Isbn: 9781489978011 - fundamentals of lead-free solder interconnect technology: from microstructures to reliability (4 Ergebnisse)

Taschenbuch. Zustand: Neu. Fundamentals of Lead-Free Solder Interconnect Technology | From Microstructures to Reliability | Tae-Kyu Lee (u. a.) | Taschenbuch | xiii | Englisch | 2016 | Springer | EAN 9781489978011 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Paperback. Zustand: Brand New. reprint edition. 253 pages. 9.00x6.00x0.75 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.…

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 268 | Sprache: Englisch | Produktart: Bücher | This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.…