9781461568049 - Deformation of Ceramic Materials II (Materials Science Research, Band 18) von Tressler, Richard E.; Bradt, Richard C. (5 Ergebnisse)

Zustand: New. In.

Zustand: New.

Taschenbuch. Zustand: Neu. Deformation of Ceramic Materials II | Richard E. Tressler (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9781461568049 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Paperback. Zustand: Brand New. reprint edition. 762 pages. 9.45x6.61x1.73 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume 'Deformation of Ceramic Materials II' constitutes the proceedings of an international symposium held at The Pennsyl vania State University, University Park, PA on July 20, 21, and 22, 1983. It includes studies of semiconductors and minerals which are closely related to ceramic materials. The initial conference on this topic was held in 1974 at Penn State and the proceedings were published in the volume entitled 'Deformation of Ceramic Materials.' This conference emphasized the deformation behavior of crystals and po1ycrysta11ine and polyphase ceramics with internationally recognized authorities as keynote lecturers on the major subtopics. Several papers dealing with cavity nucleation and creep crack growth represent a major new research thrust in ceramics since the first conference. This collection of papers represents the state-of-the art of our understanding of the plastic deformation behavior of ceramics and the crystals of which they are composed. We are grateful for the suggestions of our International Advisory Committee .in recommending experts in their respective countries to participate. We are particularly grateful that the organizers of the previous Dislocation-Point Defect Interaction Workshops agreed to participate in the Penn State Symposium as an alternative at the suggestion of Prof. A. H. Heuer. We acknowledge the financial support of the National Science Foundation for this conference.