Isbn: 9781461455073 - designing tsvs for 3d integrated circuits (springerbriefs in electrical and computer engineering) (4 Ergebnisse)

Zustand: New. In English.

Paperback. Zustand: Brand New. 2013 edition. 86 pages. 9.00x6.00x0.25 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.…

Taschenbuch. Zustand: Neu. Designing TSVs for 3D Integrated Circuits | Nauman Khan (u. a.) | Taschenbuch | SpringerBriefs in Electrical and Computer Engineering | x | Englisch | 2012 | Humana | EAN 9781461455073 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…