Isbn: 9781461375739 - high-frequency characterization of electronic packaging (electronic packaging and interconnects, band 1) (4 Ergebnisse)

Zustand: New. In English.

Paperback. Zustand: Brand New. 170 pages. 9.30x6.20x0.40 inches. In Stock.

Taschenbuch. Zustand: Neu. High-Frequency Characterization of Electronic Packaging | Luc Martens | Taschenbuch | Electronic Packaging and Interconnects | xii | Englisch | 2014 | Springer | EAN 9781461375739 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.…