9781402064326 - analog-baseband architectures and circuits for multistandard and low-voltage wireless transceivers (analog circuits and signal processing) von mak, pui-in; u seng pan, ben; martins, rui paulo (3 Ergebnisse)
Sprache: Englisch
Verlag: Springer, 2007
Serie: Buch 6 von 124 - Analog Circuits and Signal Processing
- Hardcover
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Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Sprache: Englisch
Verlag: Springer, 2007
Serie: Buch 6 von 124 - Analog Circuits and Signal Processing
- Hardcover
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Sprache: Englisch
Verlag: Springer, 2007
Serie: Buch 6 von 124 - Analog Circuits and Signal Processing
- Hardcover
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The prospect of initializing a network-ubiquitous society in the years to come has led to the development of multistandard-compliant wireless transceivers for seamless roaming among multiple networks. To ensure a commercial success of such a development, th…e manufacturing cost and power consumption of the system chips have to be minimized. The use of an advanced technology and a high level of integration have continued to be the most effective ways for cost and power minimization, given that wireless chips integrate large amounts of digital logic for computation. Regrettably, entering into the nanoelectronics era, the thinner transistor gate oxide implicates great challenges in the design of the analog front-ends. While a low-voltage supply is imposed to maintain device reliability, a relatively large threshold voltage is also necessitated to limit the leakage current. Thus, transceiver architectures and circuits which will befit future full integration of multistandard wireless transceivers in sub-1V nanoscale CMOS processes must be highly reconfigurable and robustly operational underneath a l- voltage supply. This book presents novel analog-baseband architectures and circuits that help realizing multistandard and low-voltage wireless transceivers. The main contents are presented from Chapter 2 to Chapter 6, as pictorially outlined in Figure 1. Chapter 1 overviews the current wireless-IC developments and presents the motivation and research objectives of this book. xi xii Preface Figure 1.
