9781402017650 - structural integrity and reliability in electronics: enhancing performance in a lead-free environment von plumbridge, w.j.; matela, r.j.; westwater, a. (7 Ergebnisse)
- Hardcover
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USARomtrade Corp.
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 138,97
Versand nach gratisVersand innerhalb von USAAnzahl: 1 verfügbar
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes KönigreichRia Christie Collections
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 164,78
EUR 13,90 VersandVersand von Vereinigtes Königreich nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New. In.
- Hardcover
Anbieter: Majestic Books, Hounslow, Vereinigtes KönigreichMajestic Books
Verkäufer/-in kontaktierenVerkäufer/-in mit 4 SternenZustand: Gebraucht
EUR 191,31
EUR 7,54 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Zustand: Used. pp. 360 Illus.
- Hardcover
Anbieter: Biblios, frankfurt am main, HESSE, DeutschlandBiblios
Verkäufer/-in kontaktierenVerkäufer/-in mit 4 SternenZustand: Gebraucht
EUR 189,99
EUR 9,95 VersandVersand von Deutschland nach USAAnzahl: 1 verfügbar
Zustand: Used. pp. 360.
- Hardcover
Anbieter: moluna, Greven, Deutschlandmoluna
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 178,14
EUR 48,99 VersandVersand von Deutschland nach USAAnzahl: Mehr als 20 verfügbar
Gebunden. Zustand: New. Knowledge itself is soon obsolete It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated ab.
Structural Integrity and Reliability in Electronics
Plumbridge, W.J. (The Open University, Milton Keynes, UK); Matela, Raymond J.; Westwater, A. (Rohm Electronics (UK) Ltd., Milton Keynes, UK)
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 251,58
EUR 9,19 VersandVersand innerhalb von USAAnzahl: 15 verfügbar
Zustand: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinary t…eaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . . Books ship from the US and Ireland.
- Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 247,94
EUR 63,88 VersandVersand von Deutschland nach USAAnzahl: 2 verfügbar
Buch. Zustand: Neu. Neuware - Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represe…nts a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
