Isbn: 9781118831335 - adhesion in microelectronics (adhesion and adhesives - fundamental and applied aspects) (7 Ergebnisse)

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In English.

Hardcover. Zustand: Brand New. 350 pages. 9.25x6.25x1.00 inches. In Stock.

Zustand: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include* Various theories or mechanisms of adhesion* Surface (phys.

Zustand: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Series: Adhesion and Adhesives: Fundamental and Applied Aspects. Num Pages: 368 pages, black & white illustrations, black & white line drawings, black & white tables, figures. BIC Classification: TDCB; TJF. Category: (P) Professional & Vocational. Dimension: 244 x 163 x 25. Weight in Grams: 636. . 2014. Hardback. . . . . Books ship from the US and Ireland. …

Buch. Zustand: Neu. Neuware - This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;\* Various theories or mechanisms of adhesion\* Surface (physical or chemical) characterization of materials as it pertains to adhesion\* Surface cleaning as it pertains to adhesion\* Ways to improve adhesion\* Unraveling of interfacial interactions using an array of pertinent techniques\* Characterization of interfaces / interphases\* Polymer-polymer adhesion\* Metal-polymer adhesion (metallized polymers)\* Polymer adhesion to various substrates\* Adhesion of thin films\* Adhesion of underfills\* Adhesion of molding compounds\* Adhesion of different dielectric materials\* Delamination and reliability issues in packaged devices\* Interface mechanics and crack propagation\* Adhesion measurement of thin films and coatings.…

Buch. Zustand: Neu. Adhesion in Microelectronics | K L Mittal (u. a.) | Buch | Preface xiiiAcknowledgements xviPart 1: Adhesion: Fundamentals and Measurement1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy | Englisch | 2014 | Wiley | EAN 9781118831335 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu.…