Sprache: Englisch
Verlag: Cambridge University Press, 2006
ISBN 10: 0521031702 ISBN 13: 9780521031707
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 59,36
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Sprache: Englisch
Verlag: Cambridge University Press, 2006
ISBN 10: 0521031702 ISBN 13: 9780521031707
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New. A comprehensive account of the application of electron-based microscopies to the study of high-Tc superconductors. Editor(s): Browning, Nigel D.; Pennycook, Stephen. Num Pages: 408 pages, 267 b/w illus. 3 tables. BIC Classification: PHFC; TGM. Category: (P) Professional & Vocational. Dimension: 247 x 174 x 21. Weight in Grams: 650. . 2006. Illustrated. paperback. . . . . Books ship from the US and Ireland.
Sprache: Englisch
Verlag: Cambridge University Press, 2006
ISBN 10: 0521031702 ISBN 13: 9780521031707
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This is a clear account of the application of electron-based microscopies to the study of high-Tc superconductors. Written by leading experts, this compilation provides a comprehensive review of scanning electron microscopy, transmission electron microscopy and scanning transmission electron microscopy, together with details of each technique and its applications. Introductory chapters cover the basics of high-resolution transmission electron microscopy, including a chapter devoted to specimen preparation techniques, and microanalysis by scanning transmission electron microscopy. Ensuing chapters examine identification of superconducting compounds, imaging of superconducting properties by low-temperature scanning electron microscopy, imaging of vortices by electron holography and electronic structure determination by electron energy loss spectroscopy. The use of scanning tunnelling microscopy for exploring surface morphology, growth processes and the mapping of superconducting carrier distributions is discussed. Final chapters consider applications of electron microscopy to the analysis of grain boundaries, thin films and device structures. Detailed references are included.