ISBN: 9780471964889 - joining processes: an introduction (12 Ergebnisse)

Zustand: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

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paperback. Zustand: New. In shrink wrap. Looks like an interesting title.

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Kartoniert / Broschiert. Zustand: New. This is a very informative book which groups together a number of varied topics. --Assembly Automation, Vol 20/2, 2000Joining Processes An Introduction David Brandon and Wayne D. Kaplan Technion, Israel Institute of Technology, Israel This is an introd.

Paperback. Zustand: Brand New. 1st edition. 378 pages. 9.00x6.00x1.00 inches. In Stock.

Zustand: New. Joining Processes An Introduction David Brandon and Wayne D. Kaplan Technion, Israel Institute of Technology, Israel This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. Num Pages: 378 pages, colour diagrams. BIC Classification: TGB; TGM; TGP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 224 x 149 x 22. Weight in Grams: 530. . 1997. 1st Edition. Paperback. . . . . Books ship from the US and Ireland.…

Taschenbuch. Zustand: Neu. Neuware - Joining Processes An Introduction David Brandon and Wayne D. Kaplan Technion, Israel Institute of Technology, Israel This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.…