Isbn: 9780471111887 - optoelectronic packaging (wiley series in microwave and optical engineering) (4 Ergebnisse)

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Hardback. Zustand: Good. This title presents both the foundational theory of optoelectronic packaging and the many practical applications. Topics covered include component level packaging, guided wave interconnects, free space interconnects, and displays.

Hardcover. Zustand: Good. The missing link in a dynamically growing field - a state-of-the-art reference on optoelectronic packaging The rapidly expanding field of packaging for optoelectronic devices challenges electrical engineers with a host of complex and daunting problems. The increasing intricacy of assemblage compounds the thorny interconnection issues associated with electronic packaging-how to assemble an array with many elements efficiently while maintaining thermal tolerance and simultaneously overcoming the ensuing modulation problems that generate electrical noise. Adding to these problems has been the absence, until now, of a single authoritative reference on the subject. Optoelectronic Packaging is the first and only comprehensive sourcebook on optoelectronic assembly techniques. For optoelectronic packaging experts and professionals in adjunct technologies, it provides an overview of today's state-of-the-art technologies, packages now on the drawing board, and the future direction of packaging types. For the novice, it lays down the fundamentals of optics and packaging.;This incomparable text features contributions from hands-on practitioners and, supplemented with extensive illustrations, it Covers detector, semiconductor laser, and optical amplifier packaging Discusses waveguide technologies, free-space interconnects, and hybrid technologies Examines communication system interconnection structure and fiber-optic networks in telecommunications Explores array device packaging and flip-chip assembly for smart pixel arrays Includes case studies of packaged subassemblies Copyright © Wiley.…

Zustand: New. pp. 280.