Isbn: 9780471017554 - design and analysis of heat sinks (thermal management of microelectronic and electronic system series) (9 Ergebnisse)

Zustand: Good. Good++; Hardcover; Covers are still glossy; Unblemished textblock edges; Name inside the front cover; Highlighting to about 10 pages, otherwise text pages are all clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.6 lbs; Light blue covers with title in black lettering; 1995, Wiley-Interscience Publishing; 424 pages; "Design and Analysis of Heat Sinks," by Allan D. Kraus & Avram Bar-Cohen.…

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In English.

Zustand: New. pp. 424.

Gebunden. Zustand: New. This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices.

Hardcover. Zustand: Brand New. 1st edition. 407 pages. 9.50x6.50x1.00 inches. In Stock.

Zustand: New. This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices. Series: Thermal Management of Microelectronic and Electronic System Series. Num Pages: 424 pages, Illustrations. BIC Classification: TBC; TGMB; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 239 x 161 x 32. Weight in Grams: 804. . 1995. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

Buch. Zustand: Neu. Neuware - A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . . Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities. Other topics covered include: \* Fundamentals of heat transfer \* Thermal modeling of electronic packages \* Mathematical tools for heat-sink analysis and design \* Prevailing thermal transport processes \* Models for a variety of fin geometries \* Simple 'transfer function' relations for single fin, cascadedfin, and fin array heat sinks \* Thermal characterization and optimization of plate-fin heatsinks Completely self-contained and filled with valuable information notavailable from any other single source, Design and Analysis of HeatSinks is both a superior reference for accomplished thermalspecialists and an excellent textbook for graduate courses inadvanced thermal applications for mechanical engineering students.This book can also serve as a text in thermal science for studentsof electrical engineering.…