ISBN: 9780470971826 - lead-free solders: materials reliability for electronics (wiley series in materials for electronic & optoelectronic applications) (3 Ergebnisse)

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  • Sprache: Englisch

    Verlag: John Wiley & Sons, 2012

    0470971827 / 9780470971826

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    Gebunden. Zustand: New. K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders.

  • Sprache: Englisch

    Verlag: John Wiley and Sons Ltd, 2012

    0470971827 / 9780470971826

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    Zustand: New. Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Editor(s): Subramanian, Kanakasabapathi. Series: Wiley Series in Materials for Electronic & Optoelectronic Applications. Num Pages: 520 pages, Illustrations. BIC Classification: TGM; TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 174 x 28. Weight in Grams: 934. . 2012. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

  • Sprache: Englisch

    Verlag: Wiley Apr 2012, 2012

    0470971827 / 9780470971826

    • Hardcover

    Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH

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    Buch. Zustand: Neu. Neuware - Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:\* Phase diagrams and alloy development\* Effect of minor alloying additions\* Composite approaches including nanoscale reinforcements\* Mechanical issues affecting reliability\* Reliability under impact loading\* Thermomechanical fatigue\* Chemical issues affecting reliability\* Whisker growth\* Electromigration\* ThermomigrationPresenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.…