Anbieter: WeBuyBooks, Rossendale, LANCS, Vereinigtes Königreich
EUR 95,96
Anzahl: 1 verfügbar
In den WarenkorbZustand: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. Ex library copy with usual stamps & stickers.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 122,93
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
EUR 136,04
Anzahl: Mehr als 20 verfügbar
In den WarenkorbGebunden. Zustand: New. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming test and try out method to obtain the best solution. Modeling and sim.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Neuware.
Anbieter: Kennys Bookstore, Olney, MD, USA
EUR 241,87
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing. Num Pages: 592 pages, Illustrations. BIC Classification: TGP; TJF. Category: (P) Professional & Vocational. Dimension: 254 x 174 x 35. Weight in Grams: 1136. . 2011. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.