Isbn: 9780470827802 - modeling and simulation for microelectronic packaging assembly: manufacturing, reliability and testing (5 Ergebnisse)

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In.

Zustand: New. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming test and try out method to obtain the best solution. Modeling and sim.

Zustand: New. An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing. Num Pages: 592 pages, Illustrations. BIC Classification: TGP; TJF. Category: (P) Professional & Vocational. Dimension: 254 x 174 x 35. Weight in Grams: 1136. . 2011. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.…

Buch. Zustand: Neu. Neuware.