9780387765327 - wafer level 3-d ics process technology (integrated circuits and systems) (4 Ergebnisse)
Sprache: Englisch
Verlag: Springer, 2008
Serie: Integrated Circuits and Systems, Buch 20 von 34. Buch 20 von 34 - Integrated Circuits and Systems
- Hardcover
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USARomtrade Corp.
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 100,39
Versand nach gratisVersand innerhalb von USAAnzahl: 1 verfügbar
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Sprache: Englisch
Verlag: Springer, 2008
Serie: Integrated Circuits and Systems, Buch 20 von 34. Buch 20 von 34 - Integrated Circuits and Systems
- Hardcover
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes KönigreichRia Christie Collections
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 166,57
EUR 14,05 VersandVersand von Vereinigtes Königreich nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New. In.
Sprache: Englisch
Verlag: Springer, Springer, 2008
Serie: Integrated Circuits and Systems, Buch 20 von 34. Buch 20 von 34 - Integrated Circuits and Systems
- Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 168,73
EUR 63,65 VersandVersand von Deutschland nach USAAnzahl: 1 verfügbar
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor… of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
Sprache: Englisch
Verlag: Springer Verlag, 2008
Serie: Integrated Circuits and Systems, Buch 20 von 34. Buch 20 von 34 - Integrated Circuits and Systems
- Hardcover
Anbieter: Revaluation Books, Exeter, Vereinigtes KönigreichRevaluation Books
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 239,73
EUR 14,66 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 2 verfügbar
Hardcover. Zustand: Brand New. 1st edition. 410 pages. 9.75x9.50x0.75 inches. In Stock.
