Isbn: 9780070266940 - electronic packaging and interconnection handbook (electronic packaging and interconnection series) (6 Ergebnisse)

Hardback. Zustand: Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations.…

Hardback. Zustand: Very Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations.…

Zustand: Good. 2nd Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Zustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1600grams, ISBN:9780070266940.…