Produktart
Zustand
Einband
Weitere Eigenschaften
Land des Verkäufers
Verkäuferbewertung
Verlag: De Gruyter, 1991
ISBN 10: 3112573277ISBN 13: 9783112573273
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Keine ausführliche Beschreibung für 'Bondkontakte' verfügbar.
Verlag: Springer London, 2010
ISBN 10: 1849969671ISBN 13: 9781849969673
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.
Verlag: Verlag Technik, 1996
ISBN 10: 3341011730ISBN 13: 9783341011737
Anbieter: unifachbuch e.K., Köln, NRW, Deutschland
Buch
Gebunden. Zustand: Gebraucht. Neu 150 pp. Deutsch.
Verlag: Springer, 2005
Anbieter: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Deutschland
Verbandsmitglied: GIAQ
Buch
Hardcover/Pappeinband. 527 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 984.
Verlag: Springer London, 2005
ISBN 10: 1852339411ISBN 13: 9781852339418
Anbieter: moluna, Greven, Deutschland
Buch
Gebunden. Zustand: New. No other book covers all of the materials used in the information technology industry, covering characterisation, properties and synthesis of novel materials for this fast-changing industryDr Ehrenfried Zschech is manager of the Materials Anal.
Verlag: Berlin : Verl. Technik,, 1997
ISBN 10: 3341011730ISBN 13: 9783341011737
Anbieter: Wanda Schwörer, Engelsbrand, Deutschland
Buch Erstausgabe
Pp. Zustand: Gut. 1. Aufl. 150 S. : Ill., graph. Darst. ; 25 cm gutes bis sehr gutes Exemplar Sprache: Deutsch Gewicht in Gramm: 472.
Verlag: John Wiley & Sons, 2012
ISBN 10: 0470662549ISBN 13: 9780470662540
Anbieter: moluna, Greven, Deutschland
Buch
Gebunden. Zustand: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.