zhang g q (26 Ergebnisse)

Zustand: Good. *Price HAS BEEN REDUCED by 10% until Monday, Dec. 1 (SALE item)* 423 pp., hardcover, ex library, else text clean & binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.

Hardcover. Zustand: Fine. Zustand des Schutzumschlags: Fine. 1st Edition. 171 Pp. Grey Cloth Printed In Very Light Grey. First Printing. Fine In Fine Dust Jacket.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Softcover. Zustand: Sehr gut. 1. Auflage. Paperback, printed in Chinese (short) Characters; for Students, libraries and teachers of Chinese language and culture. 304 pp., Prosa and Verse; CONTENTS in English and Chinese, e.g. Approching the goddess and the psychological construction of its production by J.Li; On the Manchu Shaman myth of heaven, Totem and the theory of indefinite sex, The different influences of Religion and Witchcraft on the spread of myths. On the ethnological study of myths during the War of Resistance against Japan, On the influence of Indian Naga tales on Chinese tales about Dragonking and his daughter, etc.; clean pages, no markings, in stock. Sofort lieferbar.

Zustand: New. pp. 588 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Hardcover. Zustand: Brand New. 240 pages. 8.75x5.50x0.75 inches. In Stock.

Zustand: New. pp. 426.

Hardcover. Zustand: Very Good. 1. Auflage. Unread, some shelfwear. Immediately dispatched from Germany.

Gebunden. Zustand: New. Peyman Sabet teaches ESL at Curtin University, Australia. He has taught sociolinguistics, and research methodology at Curtin University, and EFL, linguistics, teaching methodology and research methodology to undergraduate students of TEFL in Iran. His resea.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Paperback. Zustand: Brand New. 204 pages. 9.25x6.00x0.46 inches. In Stock.

Taschenbuch. Zustand: Neu. Benefiting from Thermal and Mechanical Simulation in Micro-Electronics | G. Q. Zhang (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer US | EAN 9781441948731 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 566 | Sprache: Englisch | Produktart: Bücher.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Comprehensive in scope, this book covers the latest progresses of theories, technologies and applications of LEDs based on III-V semiconductor materials, such as basic material physics, key device issues (homoepitaxy and heteroepitaxy of the materials on different substrates, quantum efficiency and novel structures, and more), packaging, and system integration. The authors describe the latest developments of LEDs with spectra coverage from ultra-violet (UV) to the entire visible light wavelength. The major aspects of LEDs, such as material growth, chip structure, packaging, and reliability are covered, as well as emerging and novel applications beyond the general and conventional lightings. This book, written by leading authorities in the field, is indispensable reading for researchers and students working with semiconductors, optoelectronics, and optics. Addresses novel LED applications such as LEDs for healthcare and wellbeing, horticulture, and animal breeding; Editor and chapter authors are global leading experts from the scientific and industry communities, and their latest research findings and achievements are included; Foreword by Hiroshi Amano, one of the 2014 winners of the Nobel Prize in Physics for his work on light-emitting diodes.

Hardcover. Zustand: Brand New. 600 pages. 9.25x6.25x1.50 inches. In Stock.

Taschenbuch. Zustand: Neu. Mechanics of Microelectronics | G. Q. Zhang (u. a.) | Taschenbuch | xiv | Englisch | 2010 | Springer Netherland | EAN 9789048172313 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Neuware -From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research.Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 584 pp. Englisch.

Gebunden. Zustand: New. Covers issues essential for current and future development of Microelectronics and MicrosystemsProvides a systematic overview for not only the state-of-the-art, but also future roadmap and perspectives of Microelectronics and Microsystems and the .

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Paperback. Zustand: Brand New. 576 pages. 9.21x6.10x1.30 inches. In Stock.

Hardcover. Zustand: Brand New. 1st edition. 425 pages. 9.72x7.13x0.91 inches. In Stock.

Buch. Zustand: Neu. Neuware - From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Hardcover. Zustand: Brand New. 1st edition. 504 pages. 9.50x6.50x1.25 inches. In Stock.

Pictorial hard covers. Zustand: Fine. No Jacket. 1st edition. Summary in Englsh on pp. 188-194; figure captions of expedition photographs in Chinese and English. Weight: 1.0 Language: Chinese and English.