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Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
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Soft cover. Zustand: Very Good. Clean and tightly bound with fine, unmarked contents. A few creases to cover corners, otherwise fine.
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In den WarenkorbZustand: New. pp. 292.
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In den WarenkorbHardcover. Zustand: Brand New. 1st edition. 320 pages. 9.50x7.75x1.00 inches. In Stock.
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In den WarenkorbZustand: New. pp. 1200 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Sprache: Deutsch
Verlag: Peking : Verlag für Fremdsprachige Literatur,, 1974
Anbieter: Versandantiquariat buch-im-speicher, Berlin, Deutschland
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farb. illustr. Org.-Broschur. Zustand: Gut. 115 S. : überwiegend s-w-Illustr. ; 13 x 19 cm (quer) Einband etwas berieben und bestoßen, leicht lichtrandig, wenige Seiten leicht knickspurig, sonst gut. Sprache: Deutsch Gewicht in Gramm: 300.
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In den WarenkorbZustand: New. pp. 798 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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In den WarenkorbHardcover. Zustand: Brand New. 2015 edition. 234 pages. 9.50x6.50x0.75 inches. In Stock.
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Taschenbuch. Zustand: Neu. Embedded and Ubiquitous Computing | IFIP International Conference, EUC 2007, Taipei, Taiwan, December 17-20, 2007, Proceedings | Tei-Wei Kuo (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2007 | Springer | EAN 9783540770916 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
Sprache: Englisch
Verlag: Springer-Verlag New York Inc, 2008
ISBN 10: 3540770917 ISBN 13: 9783540770916
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In den WarenkorbPaperback. Zustand: Brand New. 1st edition. 769 pages. 9.25x6.00x1.25 inches. In Stock.
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In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 232 pages. 9.25x6.10x0.55 inches. In Stock.
Sprache: Englisch
Verlag: Springer, Berlin, Springer Berlin Heidelberg, Springer, 2007
ISBN 10: 3540770917 ISBN 13: 9783540770916
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - It has been widely recognized that embedded and ubiquitous computing will have tremendous impacts on many aspects of our daily life. Innovation and close collaboration between academia and industry are the keys to guaranteeing success in the development and deployment of the technology in embedded and ubiquitous computing. TheIFIP InternationalConferenceonEmbeddedandUbiquitous Computing (EUC) provides a forum for engineers and scientists in academia, industry, and governmentto address challenges and to present and discuss their ideas, results, work in progress and experience. The Technical Program Committee (TPC) of EUC 2007 was lead by the TPC Chair, Tei-Wei Kuo, and TPC Vice Chairs. A strong international TPC was formed to review and evaluate the submissions. Each paper was reviewed carefully by at least three TPC members or external reviewers. It was extremely di cult for the TPC to select the presentations because there were so many excellent and interesting submissions. There were 217 submissions from all over the world, and only 65 papers are published in this proceedings volume.
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Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 769 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg, 2006
ISBN 10: 3540366792 ISBN 13: 9783540366799
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In den WarenkorbZustand: New. Proceedings of the International Conference on Embedded and Ubiquitous Computing, EUC 2006Presents 113 revised full papers together with 3 keynote articlesTopics include power aware computing, security and fault tolerance, agent and distrib.
Sprache: Englisch
Verlag: Springer-Verlag New York Inc, 2006
ISBN 10: 3540366792 ISBN 13: 9783540366799
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In den WarenkorbPaperback. Zustand: Brand New. 1st edition. 1170 pages. 9.00x6.00x1.50 inches. In Stock.
Sprache: Englisch
Verlag: Springer, Berlin, Springer, 2006
ISBN 10: 3540366792 ISBN 13: 9783540366799
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Neuware - Embedded and ubiquitous computing is an exciting new paradigm that p- vides computing and communication services all the time, everywhere. Now we can attach computing and communication devices to human bodies to mo- tor our health, embed computing chips into brains to cure memory losses, or make smart fabrics so they can change colors or generate heat. All these new devices are created to the bene ts or convenience of human lives. We need c- ativity as well as the advance of technology. This emergence is an outcome of researchand technologicaladvances in embedded software,embedded hardware, pervasivecomputing andcommunications,wireless networks,mobilecomputing, distributed computing and agent technologies, etc. The EUC 2006 conference provided a forum for engineers and scientists in academia, industry, and government to address challenges and to present and discuss their ideas, results, work in progress, and experience. The Technical Program Committee of EUC 2006 was led by the TPC Chair, Edwin Shan, and 13 TPC Vice Chairs. A strong international Technical Program Committee was then formed to review, evaluate the submissions, and select the papers to be presented.
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This conference is one of the most significant annual events of the China Electrotechnical Society, showcasing the latest research trends, methodologies, and experimental results in electrical, electronic, and networked energy systems. The proceedings cover a wide range of cutting-edge theories and ideas, including topics such as power systems, power electronics, smart grids, renewable energy, energy integration in transportation, advanced power technologies, and the energy internet.The aim of these proceedings is to provide a key interdisciplinary platform for researchers, engineers, academics, and industry professionals to present groundbreaking developments in the field of electrical, electronic, and networked energy systems. It also offers engineers and researchers from academia, industry, and government a comprehensive view of innovative solutions that integrate concepts from multiple disciplines.These volumes serve as a valuable reference for researchers and graduate students in electrical engineering.