wang li c (64 Ergebnisse)

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Very Good. No Jacket. Former library book; May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 1.01.

Paperback. Zustand: Very Good. The book has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.

Hardcover. Zustand: Fair. Zustand des Schutzumschlags: Good+. First Edition; No Printing Stated. Harvard East Asian Monographs; 376 pages; light pencil markings throughout the book. Light fading on DJ's spine. Minor tear on DJ's spine head. Very Good condition otherwise. No other noteworthy defects. ; - Your satisfaction is our priority. We offer free returns and respond promptly to all inquiries. Your item will be carefully cushioned in bubble wrap and securely boxed. All orders ship on the same or next business day. Buy with confidence.

Zustand: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.

Paperback. Zustand: Very Good. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Zustand: very good. Gut/Very good: Buch bzw. Schutzumschlag mit wenigen Gebrauchsspuren an Einband, Schutzumschlag oder Seiten. / Describes a book or dust jacket that does show some signs of wear on either the binding, dust jacket or pages.

Zustand: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.

Zustand: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.

(S. A. Molec. gen. Genet. 176) 1979. S. 385 - 392. gr8. m. zahlr. Abb. (St.) br. -2) Sonderabdruck.

Zustand: New. pages cm.

Zustand: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.

Paperback. Zustand: Brand New. 656 pages. 9.25x6.10x1.18 inches. In Stock.

Zustand: New.

Taschenbuch. Zustand: Neu. Neuware -This book constitutes the refereed proceedings of the 37th International Conference on Conceptual Modeling, ER 2018, held in XI'an, China, in October 2018.The 30 full and 13 short papers presented together with 3 keynotes were carefully reviewed and selected from 151 submissions.This events covers a wide range of following topics: Conceptual modeling studies, ontological modeling, semi-structured data modeling, process modeling and management, spatio-temporal modeling, cloud-based modeling, schema and view modeling,languages and models, NoSQL modeling, conceptual modeling for machine learning and reasoning, applications of conceptual modeling.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 656 pp. Englisch.

Paperback. Zustand: Brand New. 432 pages. 9.68x6.87x9.69 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the refereed proceedings of the 37th International Conference on Conceptual Modeling, ER 2018, held in XI'an, China, in October 2018.The 30 full and 13 short papers presented together with 3 keynotes were carefully reviewed and selected from 151 submissions.This events covers a wide range of following topics: Conceptual modeling studies, ontological modeling, semi-structured data modeling, process modeling and management, spatio-temporal modeling, cloud-based modeling, schema and view modeling,languages and models, NoSQL modeling,conceptual modeling for machine learning and reasoning,applications of conceptual modeling.

Taschenbuch. Zustand: Neu. Neuware -This book provides a state-of-the-art guide to Machine Learning (ML)-based techniques that have been shown to be highly efficient for diagnosis of failures in electronic circuits and systems. The methods discussed can be used for volume diagnosis after manufacturing or for diagnosis of customer returns. Readers will be enabled to deal with huge amount of insightful test data that cannot be exploited otherwise in an efficient, timely manner. After some background on fault diagnosis and machine learning, the authors explain and apply optimized techniques from the ML domain to solve the fault diagnosis problem in the realm of electronic system design and manufacturing. These techniques can be used for failure isolation in logic or analog circuits, board-level fault diagnosis, or even wafer-level failure cluster identification. Evaluation metrics as well as industrial case studies are used to emphasize the usefulness and benefits of using ML-based diagnosis techniques.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 328 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a state-of-the-art guide to Machine Learning (ML)-based techniques that have been shown to be highly efficient for diagnosis of failures in electronic circuits and systems. The methods discussed can be used for volume diagnosis after manufacturing or for diagnosis of customer returns. Readers will be enabled to deal with huge amount of insightful test data that cannot be exploited otherwise in an efficient, timely manner. After some background on fault diagnosis and machine learning, the authors explain and apply optimized techniques from the ML domain to solve the fault diagnosis problem in the realm of electronic system design and manufacturing. These techniques can be used for failure isolation in logic or analog circuits, board-level fault diagnosis, or even wafer-level failure cluster identification. Evaluation metrics as well as industrial case studies are used to emphasize the usefulness and benefits of using ML-based diagnosis techniques.

Zustand: New. pp. 998 Illus.

Buch. Zustand: Neu. Neuware -This book provides a state-of-the-art guide to Machine Learning (ML)-based techniques that have been shown to be highly efficient for diagnosis of failures in electronic circuits and systems. The methods discussed can be used for volume diagnosis after manufacturing or for diagnosis of customer returns. Readers will be enabled to deal with huge amount of insightful test data that cannot be exploited otherwise in an efficient, timely manner. After some background on fault diagnosis and machine learning, the authors explain and apply optimized techniques from the ML domain to solve the fault diagnosis problem in the realm of electronic system design and manufacturing. These techniques can be used for failure isolation in logic or analog circuits, board-level fault diagnosis, or even wafer-level failure cluster identification. Evaluation metrics as well as industrial case studies are used to emphasize the usefulness and benefits of using ML-based diagnosis techniques.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 328 pp. Englisch.

Hardcover. Zustand: Brand New. 327 pages. 9.25x6.10x9.21 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a state-of-the-art guide to Machine Learning (ML)-based techniques that have been shown to be highly efficient for diagnosis of failures in electronic circuits and systems. The methods discussed can be used for volume diagnosis after manufacturing or for diagnosis of customer returns. Readers will be enabled to deal with huge amount of insightful test data that cannot be exploited otherwise in an efficient, timely manner. After some background on fault diagnosis and machine learning, the authors explain and apply optimized techniques from the ML domain to solve the fault diagnosis problem in the realm of electronic system design and manufacturing. These techniques can be used for failure isolation in logic or analog circuits, board-level fault diagnosis, or even wafer-level failure cluster identification. Evaluation metrics as well as industrial case studies are used to emphasize the usefulness and benefits of using ML-based diagnosis techniques.

Zustand: New.

Paperback. Zustand: Brand New. 184 pages. 9.20x6.10x0.60 inches. In Stock.

Taschenbuch. Zustand: Neu. Neuware -To learn while being entertained is always an effective means in education. With the advance in technologies, in particular graphics, multimedia, and virtual reality te- nologies, this has evolved into the specific area of ¿Edutainment¿. The second int- national conference on edutainment, Edutainment 2007, aimed to provide a forum for practitioners and researchers in the field to share their experiences and findings in this fast growing area. Following the success of Edutainment 2006, which was held in Hangzhou, China, Edutainment 2007 was held during June 11¿13, 2007 in Hong Kong. This year, we received 393 submissions from 29 different countries and areas, - cluding China (including Taiwan), USA, UK, Germany, Italy, France, Australia, C- ada, Switzerland, Korea, Japan, Singapore and Malaysia. A total of 90 papers were selected, after peer review, for this volume. Topics of these papers fall into six diff- ent areas ranging from fundamental issues in geometry and imaging to virtual reality systems and their applications in entertainment and education. These topics include Virtual Reality in Games and Education, Virtual Characters in Games and Education, E-learning Platforms and Tools, Geometry in Games and Virtual Reality, Vision, Imaging and Video Technology, and Collaborative and Distributed Environments. We are grateful to the International Program Committee and the reviewers for their effort to get all the papers reviewed in a short period of time. We would also like to thank everyone who contributed to organizing the conference.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 996 pp. Englisch.

Buch. Zustand: Neu. Neuware -This volume provides updates of this established field in both methods and applications, as well as advances in applications of the microarray method to biomarkers such as DNAs, RNAs, proteins, glycans and whole cells. Written for the Methods in Molecular Biology series, chapters include introductions to their respective topics, lists of the necessary materials and reagents, step-by-step, readily reproducible laboratory protocols, and tips on troubleshooting and avoiding known pitfalls.Authoritative and practical, Microarray Technology: Methods and Applications aims to ensure successful results in the further study of this vital field.Humana Press in Springer Science + Business Media, Heidelberger Platz 3, 14197 Berlin 308 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - To learn while being entertained is always an effective means in education. With the advance in technologies, in particular graphics, multimedia, and virtual reality te- nologies, this has evolved into the specific area of 'Edutainment'. The second int- national conference on edutainment, Edutainment 2007, aimed to provide a forum for practitioners and researchers in the field to share their experiences and findings in this fast growing area. Following the success of Edutainment 2006, which was held in Hangzhou, China, Edutainment 2007 was held during June 11-13, 2007 in Hong Kong. This year, we received 393 submissions from 29 different countries and areas, - cluding China (including Taiwan), USA, UK, Germany, Italy, France, Australia, C- ada, Switzerland, Korea, Japan, Singapore and Malaysia. A total of 90 papers were selected, after peer review, for this volume. Topics of these papers fall into six diff- ent areas ranging from fundamental issues in geometry and imaging to virtual reality systems and their applications in entertainment and education. These topics include Virtual Reality in Games and Education, Virtual Characters in Games and Education, E-learning Platforms and Tools, Geometry in Games and Virtual Reality, Vision, Imaging and Video Technology, and Collaborative and Distributed Environments. We are grateful to the International Program Committee and the reviewers for their effort to get all the papers reviewed in a short period of time. We would also like to thank everyone who contributed to organizing the conference.