Viswanadham (31 Ergebnisse)

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New.

Zustand: New. pp. 608.

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Hardcover. Zustand: Sehr gut. Gebundene Ausgabe: 370 Seiten sehr gut / fine - nur a-807.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. pp. 228.

Zustand: New. In English.

Zustand: Used. pp. 228 Epilogue.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume contains the proceedings of the first International Conference on the Science of Hard Materials held in Moran, Wyoming, Aug. 23-28, 1981. The objective of the conference was to review and advance the state of knowledge of the basic physical and chemical properties of hard materials and show how these properties influence performance in a variety of applications. To this end, the 49 con tributed papers and the four keynote papers by Prof. Fischmeister and Drs. Hintermann, Exner and Almond, present an excellent overview of the state of the art in the 'science' of hard materials. The contents of these proceedings also reflect the fact that hard metal technology is now well matured and several aspects of the behavior of these materials are well understood and firmly established. Structure-property relationships in this class of materials are currently well known. Pitfalls in some of the traditional test methods have been recognized and new test methods are being developed which discriminate between intrinsic material properties and flaw content and distribution. Application of fracture mechanics, al though a late corner to the hard materials area (as compared to other structural materials), is rapidly gaining acceptance and new fracture toughness test methods are being developed. Application of modern analysis and analytical techniques to these materials has begun and entirely new and unexpected information has been obtained. For a variety of reasons, 'hard metals' have dominated the research and development scene of 'hard materials'.…

Paperback. Zustand: Brand New. reprint edition. 1024 pages. 10.00x7.01x2.20 inches. In Stock.

Zustand: Good. Good+; Hardcover; Withdrawn library copy with minimal library markings; Light wear to the covers; Library stamps to the endpapers; Text pages are clean & unmarked; Binding is excellent with a straight spine; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Black covers with title in yellow lettering; 1997, Springer-Verlag Publishing; 370 pages; "Failure Modes and Mechanisms in Electronic Packages," by P. Singh & Puligandla Viswanadham.…

Softcover. Zustand: sehr gut. Originalbroschur. 4°. 8 Seiten. m. 1 Figur und 2 Tabellen. ausgeschiedenes Bibliotheksexemplar. knittrig und berieben. Ex. m. 2 Längsknicken. angerändert. gebräunt. Kodaikanal Observatory. Bulletin No. CLXX. DGO. 11. 170 / 385. in englischer Sprache (in english).

Paperback. Zustand: Brand New. 296 pages. 8.66x5.91x0.67 inches. In Stock.

Zustand: Gut. Zustand: Gut | Seiten: 350 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: New.

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Those of us who grew up in the 'through-hole' age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of 'the chip. ' Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product.…

Taschenbuch. Zustand: Neu. Failure Modes and Mechanisms in Electronic Packages | Puligandla Viswanadham (u. a.) | Taschenbuch | xxi | Englisch | 2012 | Springer US | EAN 9781461377634 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Zustand: Neu. Analysis of Manufacturing Enterprises | An Approach to Leveraging Value Delivery Processes for Competitive Advantage | N. Viswanadham | Taschenbuch | xx | Englisch | 2012 | Humana | EAN 9781461371014 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Analysis of Manufacturing Enterprises presents a unified and systematic treatment of manufacturing enterprises. These enterprises are networks of companies working in partnership. Such networks are a common occurrence in auto, grocery, apparel, computer and other industries; and competition is among enterprises rather than between individual companies. Thus, for these enterprises (global or local) to succeed, there is a need for systematically designing the enterprise-wide value delivery processes such as the order-to-delivery process, supply chain process, and new product development process. This calls for developing systematic analysis methodologies for evaluating the performance of value delivering processes. Analysis of Manufacturing Enterprises fills this vital need. The first part of the book focuses on foundations of manufacturing enterprises: the generic value delivery process, their performance measures and redesign to meet specifications on lead time and defect levels. The second part provides a clear and comprehensive discussion on new product development, order to delivery, and supply chain processes, which are core processes of a manufacturing enterprise. Analysis of Manufacturing Enterprises is an excellent resource for researchers and professionals in the field of manufacturing engineering.…

Buch. Zustand: Neu. Neuware - Those of us who grew up in the 'through-hole' age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of 'the chip. ' Much attention is focussed on the silicon and on the marvelous production and entertainment tools we now see in our offices and homes. Between the silicon and the end product lies the less publicized world of circuit-level packaging. We leave it to a cadre of technologists to take the schematics and parts lists and to develop the processes that tum the designers' concepts into physical reality. And while the silicon transistor is shrinking, the engineering challenges of packaging multiple chips and associated components into increasingly dense subsystems are growing. Further, the transistor may have to function without failure through severe industrial or military environments over the lifetime of the product.…

Zustand: New. Presents a unified and systematic treatment of manufacturing enterprises. These enterprises are networks of companies working in partnership. This book focuses on foundations of manufacturing enterprises: the generic value delivery process, their performance measures and redesign to meet specifications on lead time and defect levels. Series: The International Series on Discrete Event Dynamic Systems. Num Pages: 292 pages, biography. BIC Classification: KJMV5; KN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 19. Weight in Grams: 620. . 1999. Hardback. . . . . Books ship from the US and Ireland.…

Zustand: New.

Zustand: New.