tsui ying (17 Ergebnisse)

Zustand: Good. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.

Zustand: Good. Used book that is in clean, average condition without any missing pages.

Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 0.85.

Zustand: Very Good. 1943. Hardcover. Very good clean copy in original cloth covers. Title in tilt to spine. Small nick on the spine. Ex-Libris with stamps on ffep, remains very good. . . . . Books ship from the US and Ireland.

Zustand: Very Good. 1943. Hardcover. Very good clean copy in original cloth covers. Title in tilt to spine. Small nick on the spine. Ex-Libris with stamps on ffep, remains very good. . . . .

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.

Hardcover. Zustand: Good+. Zustand des Schutzumschlags: Good+. Moderate soiling to both DJ and boads. Chipping and tears to DJ. Not price clipped.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Taschenbuch. Zustand: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 240 pp. Englisch.

Buch. Zustand: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 240 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Zustand: New. In.

Paperback. Zustand: Brand New. 82 pages. 9.06x6.06x0.47 inches. In Stock.

Paperback. Zustand: Brand New. revised edition. 200 pages. 9.25x6.10x0.46 inches. In Stock.

Paperback. Zustand: Brand New. rep rev edition. 240 pages. 9.25x6.10x0.63 inches. In Stock.