tan sheldon (35 Ergebnisse)

Hardcover. Zustand: Good. Illustrated. It's a preowned item in good condition and includes all the pages. It may have some general signs of wear and tear, such as markings, highlighting, slight damage to the cover, minimal wear to the binding, etc., but they will not affect the overall reading experience.

Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Very Good. Shipped within 24 hours from our UK warehouse. Clean, undamaged book with no damage to pages and minimal wear to the cover. Spine still tight, in very good condition. Remember if you are not happy, you are covered by our 100% money back guarantee.

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Zustand: New. pp. xviii + 240 Illus.

Paperback. Zustand: Like New. First Edition. In nearly new condition: bright, crisp and clean with just a few creases to the covers, hence just a small publisher 'damaged' stamp at the prelims. Looks and feels unread. Thus a very nice copy, now offered for sale at a very reasonable price.

Zustand: New. pp. 290.

XXIX, 305 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.

Paperback. Zustand: Brand New. 200 pages. 9.92x6.93x0.32 inches. In Stock.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

XLI, 460 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

Paperback. Zustand: Brand New. paperback/cd-rom edition. 279 pages. 10.00x8.75x0.50 inches. In Stock.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Model order reduction (MOR) techniques reduce the complexity of VLSI designs, paving the way to higher operating speeds and smaller feature sizes. This book presents a systematic introduction to, and treatment of, the key MOR methods employed in general linear circuits, using real-world examples to illustrate the advantages and disadvantages of each algorithm. Following a review of traditional projection-based techniques, coverage progresses to more advanced MOR methods for VLSI design, including HMOR, passive truncated balanced realization (TBR) methods, efficient inductance modeling via the VPEC model, and structure-preserving MOR techniques. Where possible, numerical methods are approached from the CAD engineer's perspective, avoiding complex mathematics and allowing the reader to take on real design problems and develop more effective tools. With practical examples and over 100 illustrations, this book is suitable for researchers and graduate students of electrical and computer engineering, as well as practitioners working in the VLSI design industry.

Zustand: New. pp. 320 161 Illus. (35 Col.).

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Gebunden. Zustand: New.

Zustand: New.

Zustand: Hervorragend. Zustand: Hervorragend | Seiten: 336 | Sprache: Englisch | Produktart: Bücher | Since process variation and chip performance uncertainties have become more pronounced as technologies scale down into the nanometer regime, accurate and efficient modeling or characterization of variations from the device to the architecture level have  become imperative for the successful design of VLSI chips.This book provides readers with tools for variation-aware design methodologies and computer-aided design (CAD) of VLSI systems, in the presence of process variations at the nanometer scale. It presents the latest developments for modeling and analysis, with a focus on statistical interconnect modeling, statistical parasitic extractions, statistical full-chip leakage and dynamic power analysis considering spatial correlations, statistical analysis and modeling for large global interconnects and analog/mixed-signal circuits.  Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits;Helps chip designers understand the potential and limitations of their design tools, improving their design productivity;Presents analysis of each algorithm with practical applications in the context of real circuit design;Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.  Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits;Helps chip designers understand the potential and limitations of their design tools, improving their design productivity;Presents analysis of each algorithm with practical applications in thecontext of real circuit design;Includes numerical examples for the quantitative analysis and evaluation of algorithms presented. .

Zustand: New.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 320 | Sprache: Englisch | Produktart: Bücher | This book provides comprehensive coverage of the recent advances in symbolic analysis techniques for design automation of nanometer VLSI systems. The presentation is organized in parts of fundamentals, basic implementation methods and applications for VLSI design. Topics emphasized include statistical timing and crosstalk analysis, statistical and parallel analysis, performance bound analysis and behavioral modeling for analog integrated circuits. Among the recent advances, the Binary Decision Diagram (BDD) based approaches are studied in depth. The BDD-based hierarchical symbolic analysis approaches, have essentially broken the analog circuit size barrier.

Hardcover. Zustand: Brand New. 240 pages. 9.50x7.00x0.50 inches. In Stock.

Buch. Zustand: Neu. Neuware -This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc.Books on Demand GmbH, Überseering 33, 22297 Hamburg 304 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques.Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models;Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects;Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels;Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques.Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models;Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects;Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels;Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.

Taschenbuch. Zustand: Neu. Neuware -This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 504 pp. Englisch.

Buch. Zustand: Neu. Neuware -This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 504 pp. Englisch.

Paperback. Zustand: Brand New. reprint edition. 318 pages. 9.25x6.10x0.76 inches. In Stock.

Hardcover. Zustand: Brand New. 300 pages. 9.25x6.25x0.75 inches. In Stock.