sapatnekar sachin (29 Ergebnisse)

Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 0.64.

hardcover. Zustand: Very Good. Zustand des Schutzumschlags: No Dust Jacket. First Editon. No Jacket. Hardcover and contents in very good clean condition. Previous owner's name on FEP. Illustrated with figures. E. Used.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Good. 1999th Edition. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.

Zustand: New.

Hardcover. Zustand: Brand New. 9.25x6.25x0.50 inches. In Stock.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.

Zustand: New. Charles J. Alpert, Dinesh p. Mehta, Sachin S. SapatnekarThe physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advanc.

Hardcover. Zustand: Good. 2004. It's a preowned item in good condition and includes all the pages. It may have some general signs of wear and tear, such as markings, highlighting, slight damage to the cover, minimal wear to the binding, etc., but they will not affect the overall reading experience.

Zustand: New. pp. 332 9:B&W 6 x 9 in or 229 x 152 mm Case Laminate on Creme w/Gloss Lam.

Zustand: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher.

Taschenbuch. Zustand: Neu. Neuware - Handbook of Algorithms for Physical Design Automation provides a detailed overview of VLSI physical design automation, placing particular emphasis on state-of-the-art techniques, trends, and improvement that have emerged over the last decade. After a brief introduction to the modern physical design problem, basic algorithmic techniques, and partitioning, the book discusses significant advances in floorplanning representations and describes recent formulations of the floorplanning problem. It also addresses issues of placement, net layout and optimization, routing multiple signal nets, manufacturability, physical synthesis, special nets, and designing for specialized technologies.

Zustand: New. pp. 298 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Paperback. Zustand: Brand New. 250 pages. 9.20x6.10x0.70 inches. In Stock.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.

Taschenbuch. Zustand: Neu. Three-Dimensional Integrated Circuit Design | EDA, Design and Microarchitectures | Yuan Xie (u. a.) | Taschenbuch | xii | Englisch | 2012 | Springer US | EAN 9781461425137 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Gebunden. Zustand: New. Provides an in-depth treatment of routing congestion in VLSI circuitsComprehensively surveys the work done and points to challenges for the futureEquips readers with the knowledge to prudently choose an approach that is appropriate to their.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.

Paperback. Zustand: Brand New. 296 pages. 9.25x6.10x0.67 inches. In Stock.

Taschenbuch. Zustand: Neu. Timing | Sachin Sapatnekar | Taschenbuch | xii | Englisch | 2010 | Springer | EAN 9781441954084 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Zustand: New. pp. 316 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Buch. Zustand: Neu. Neuware -Statistical timing analysis is an area of growing importance in nanometer te- nologies¿ as the uncertainties associated with process and environmental var- tions increase¿ and this chapter has captured some of the major efforts in this area. This remains a very active field of research¿ and there is likely to be a great deal of new research to be found in conferences and journals after this book is published. In addition to the statistical analysis of combinational circuits¿ a good deal of work has been carried out in analyzing the effect of variations on clock skew. Although we will not treat this subject in this book¿ the reader is referred to [LNPS00¿ HN01¿ JH01¿ ABZ03a] for details. 7 TIMING ANALYSIS FOR SEQUENTIAL CIRCUITS 7.1 INTRODUCTION A general sequential circuit is a network of computational nodes (gates) and memory elements (registers). The computational nodes may be conceptualized as being clustered together in an acyclic network of gates that forms a c- binational logic circuit. A cyclic path in the direction of signal propagation 1 is permitted in the sequential circuit only if it contains at least one register . In general, it is possible to represent any sequential circuit in terms of the schematic shown in Figure 7.1, which has I inputs, O outputs and M registers. The registers outputs feed into the combinational logic which, in turn, feeds the register inputs. Thus, the combinational logic has I + M inputs and O + M outputs.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 312 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Statistical timing analysis is an area of growing importance in nanometer te- nologies' as the uncertainties associated with process and environmental var- tions increase' and this chapter has captured some of the major efforts in this area. This remains a very active field of research' and there is likely to be a great deal of new research to be found in conferences and journals after this book is published. In addition to the statistical analysis of combinational circuits' a good deal of work has been carried out in analyzing the effect of variations on clock skew. Although we will not treat this subject in this book' the reader is referred to [LNPS00' HN01' JH01' ABZ03a] for details. 7 TIMING ANALYSIS FOR SEQUENTIAL CIRCUITS 7.1 INTRODUCTION A general sequential circuit is a network of computational nodes (gates) and memory elements (registers). The computational nodes may be conceptualized as being clustered together in an acyclic network of gates that forms a c- binational logic circuit. A cyclic path in the direction of signal propagation 1 is permitted in the sequential circuit only if it contains at least one register . In general, it is possible to represent any sequential circuit in terms of the schematic shown in Figure 7.1, which has I inputs, O outputs and M registers. The registers outputs feed into the combinational logic which, in turn, feeds the register inputs. Thus, the combinational logic has I + M inputs and O + M outputs.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Statistical timing analysis is an area of growing importance in nanometer te- nologies' as the uncertainties associated with process and environmental var- tions increase' and this chapter has captured some of the major efforts in this area. This remains a very active field of research' and there is likely to be a great deal of new research to be found in conferences and journals after this book is published. In addition to the statistical analysis of combinational circuits' a good deal of work has been carried out in analyzing the effect of variations on clock skew. Although we will not treat this subject in this book' the reader is referred to [LNPS00' HN01' JH01' ABZ03a] for details. 7 TIMING ANALYSIS FOR SEQUENTIAL CIRCUITS 7.1 INTRODUCTION A general sequential circuit is a network of computational nodes (gates) and memory elements (registers). The computational nodes may be conceptualized as being clustered together in an acyclic network of gates that forms a c- binational logic circuit. A cyclic path in the direction of signal propagation 1 is permitted in the sequential circuit only if it contains at least one register . In general, it is possible to represent any sequential circuit in terms of the schematic shown in Figure 7.1, which has I inputs, O outputs and M registers. The registers outputs feed into the combinational logic which, in turn, feeds the register inputs. Thus, the combinational logic has I + M inputs and O + M outputs.

Zustand: New. KlappentextThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced.

Buch. Zustand: Neu. Neuware - The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order 'compact' thermal models of electronic components, a database of critical material thermal properties, and a compr.