mircea stan (9 Ergebnisse)

XIX, 208 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

Gebunden. Zustand: Second Hand. Zustand des Schutzumschlags: Kein Schutzumschlag. 1. Auflage. Text in Rumänisch.

Zustand: New. In.

Zustand: New. In.

Paperback. Zustand: Brand New. 228 pages. 9.25x6.10x0.54 inches. In Stock.

Hardcover. Zustand: Brand New. 230 pages. 9.25x6.10x0.67 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware;Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;Includes coverage of resilient aspects of emerging applications such as IoT.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware;Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;Includes coverage of resilient aspects of emerging applications such as IoT.

24,5 x 17,5 cm. Zustand: Sehr gut. 370 Seiten Leg?tura din pânz? este în stare foarte bun?, atât la interior, cât ?i la exterior. V? rug?m s? consulta?i fotografiile noastre. Leineneinband in sehr gutem Zustand, innen wie außen sehr gut. Bitte beachten Sie unsere Bilder. PU-162 ro Gewicht in Gramm: 920.