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In den WarenkorbZustand: New. pp. 204 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Soft cover. Zustand: New. 8vo (23.5 cm). VIII, 151 pp. Laminated wrappers. "People-to-people (P2P) technology-assisted interconnections, embedded in a global environment, will be at the core of 21st century communications and will command the technological development of the future. The Internet-of-Things (IoT) comprises only machine-to-machine (M2M) communications handling only data and things. Expanding itself beyond IoT, the Internet-of-Everything (IoE) also incorporates intelligently the interaction of people and process (providing at a precise moment the correct knowledge to the exact person/machine). In general, IoT comprises all physical or cyber objects (things) with an address that can transmit information without human-to-machine interactions (data), while the IoE also involves communications (processing) among the users (people) and the whole universe of electronic gadgets. Further, they both operate with data acquired from analog sources, thus connecting two different realities, the analog (physical/real) and the digital (cyber/virtual) worlds. Since the interface between the two realms deals with analog signals, its mandatory functions involve sensing, measuring, filtering, converting, processing, and connecting, with the accuracy and precision of the analog layer ruling the entire system. Such interface integrates several analog and mixed-signal subsystems that include signal sensing, transmission and reception, frequency generation, energy harvesting (EH), in-memory processing, and data and power conversion. This paper presents state-of-the-art designs of the most critical building blocks of the analog/digital interface highlighting new and innovative circuit architectures and techniques. It addresses capacitive sensor interfaces, ultra-low-power wireless transceivers, key technologies for wireline transceivers, oscillators and frequency generators, integrated energy harvesting (EH) interfaces, in-memory processing, as well as, data and power converters, all exhibiting high-quality performance with low power consumption, high energy-efficiency and high speed, thus enabling a reliable and consistent development of the IoE while enlarging its frontiers." (publisher's description).
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbHardcover. Zustand: Brand New. 126 pages. 9.25x6.25x0.50 inches. In Stock.
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Anbieter: moluna, Greven, Deutschland
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In den WarenkorbGebunden. Zustand: New.
Verlag: Springer International Publishing, 2018
ISBN 10: 331988493X ISBN 13: 9783319884936
Sprache: Englisch
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Verlag: Springer International Publishing, 2017
ISBN 10: 3319678248 ISBN 13: 9783319678245
Sprache: Englisch
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In den WarenkorbZustand: New.
Verlag: Springer International Publishing, 2015
ISBN 10: 331921523X ISBN 13: 9783319215235
Sprache: Englisch
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
Anbieter: moluna, Greven, Deutschland
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In den WarenkorbZustand: New.
Verlag: Springer, Berlin|Springer International Publishing|Springer, 2024
ISBN 10: 3031222334 ISBN 13: 9783031222337
Sprache: Englisch
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In den WarenkorbKartoniert / Broschiert. Zustand: New.
Verlag: Springer, Berlin|Springer International Publishing|Springer, 2023
ISBN 10: 303122230X ISBN 13: 9783031222306
Sprache: Englisch
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Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbPaperback. Zustand: Brand New. 199 pages. 9.50x6.00x0.46 inches. In Stock.
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In den WarenkorbHardcover. Zustand: Brand New. 150 pages. 9.25x6.10 inches. In Stock.
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In den WarenkorbHardcover. Zustand: Brand New. 102 pages. 9.50x6.25x0.50 inches. In Stock.
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Taschenbuch. Zustand: Neu. Analog-Baseband Architectures and Circuits for Multistandard and Low-Voltage Wireless Transceivers | Pui-In Mak (u. a.) | Taschenbuch | xxii | Englisch | 2010 | Springer | EAN 9789048176403 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Verlag: Springer Netherlands, Springer Netherlands, 2010
ISBN 10: 9048176409 ISBN 13: 9789048176403
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The prospect of initializing a network-ubiquitous society in the years to come has led to the development of multistandard-compliant wireless transceivers for seamless roaming among multiple networks. To ensure a commercial success of such a development, the manufacturing cost and power consumption of the system chips have to be minimized. The use of an advanced technology and a high level of integration have continued to be the most effective ways for cost and power minimization, given that wireless chips integrate large amounts of digital logic for computation. Regrettably, entering into the nanoelectronics era, the thinner transistor gate oxide implicates great challenges in the design of the analog front-ends. While a low-voltage supply is imposed to maintain device reliability, a relatively large threshold voltage is also necessitated to limit the leakage current. Thus, transceiver architectures and circuits which will befit future full integration of multistandard wireless transceivers in sub-1V nanoscale CMOS processes must be highly reconfigurable and robustly operational underneath a l- voltage supply. This book presents novel analog-baseband architectures and circuits that help realizing multistandard and low-voltage wireless transceivers. The main contents are presented from Chapter 2 to Chapter 6, as pictorially outlined in Figure 1. Chapter 1 overviews the current wireless-IC developments and presents the motivation and research objectives of this book. xi xii Preface Figure 1.
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In den WarenkorbPaperback. Zustand: Brand New. 325 pages. 9.25x6.10x0.69 inches. In Stock.
Verlag: Springer International Publishing, 2024
ISBN 10: 3031222334 ISBN 13: 9783031222337
Sprache: Englisch
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Taschenbuch. Zustand: Neu. Analog and Mixed-Signal Circuits in Nanoscale CMOS | Pui-In Mak (u. a.) | Taschenbuch | xv | Englisch | 2024 | Springer International Publishing | EAN 9783031222337 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The prospect of initializing a network-ubiquitous society in the years to come has led to the development of multistandard-compliant wireless transceivers for seamless roaming among multiple networks. To ensure a commercial success of such a development, the manufacturing cost and power consumption of the system chips have to be minimized. The use of an advanced technology and a high level of integration have continued to be the most effective ways for cost and power minimization, given that wireless chips integrate large amounts of digital logic for computation. Regrettably, entering into the nanoelectronics era, the thinner transistor gate oxide implicates great challenges in the design of the analog front-ends. While a low-voltage supply is imposed to maintain device reliability, a relatively large threshold voltage is also necessitated to limit the leakage current. Thus, transceiver architectures and circuits which will befit future full integration of multistandard wireless transceivers in sub-1V nanoscale CMOS processes must be highly reconfigurable and robustly operational underneath a l- voltage supply. This book presents novel analog-baseband architectures and circuits that help realizing multistandard and low-voltage wireless transceivers. The main contents are presented from Chapter 2 to Chapter 6, as pictorially outlined in Figure 1. Chapter 1 overviews the current wireless-IC developments and presents the motivation and research objectives of this book. xi xii Preface Figure 1.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbHardcover. Zustand: Brand New. 325 pages. 9.25x6.10x9.21 inches. In Stock.
Verlag: Springer International Publishing, Springer International Publishing Jan 2024, 2024
ISBN 10: 3031222334 ISBN 13: 9783031222337
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. Neuware -This book provides readers with a single-source reference to the state-of-the-art in analog and mixed-signal circuit design in nanoscale CMOS. Renowned authors from academia describe creative circuit solutions and techniques, in state-of-the-art designs, enabling readers to deal with today¿s technology demands for high integration levels with a strong miniaturization capability.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 328 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing Jan 2023, 2023
ISBN 10: 303122230X ISBN 13: 9783031222306
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Buch. Zustand: Neu. Neuware -This book provides readers with a single-source reference to the state-of-the-art in analog and mixed-signal circuit design in nanoscale CMOS. Renowned authors from academia describe creative circuit solutions and techniques, in state-of-the-art designs, enabling readers to deal with today¿s technology demands for high integration levels with a strong miniaturization capability.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 328 pp. Englisch.
Verlag: Springer International Publishing, 2024
ISBN 10: 3031222334 ISBN 13: 9783031222337
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a single-source reference to the state-of-the-art in analog and mixed-signal circuit design in nanoscale CMOS. Renowned authors from academia describe creative circuit solutions and techniques, in state-of-the-art designs, enabling readers to deal with today's technology demands for high integration levels with a strong miniaturization capability.
Zustand: New.
Verlag: Springer International Publishing, 2023
ISBN 10: 303122230X ISBN 13: 9783031222306
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a single-source reference to the state-of-the-art in analog and mixed-signal circuit design in nanoscale CMOS. Renowned authors from academia describe creative circuit solutions and techniques, in state-of-the-art designs, enabling readers to deal with today's technology demands for high integration levels with a strong miniaturization capability.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.