Verlag: American Chemical Society, 2004
ISBN 10: 084123857X ISBN 13: 9780841238572
Sprache: Englisch
Anbieter: Powell's Bookstores Chicago, ABAA, Chicago, IL, USA
EUR 15,57
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Used - Very Good. 2004. Hardcover. Dec. cloth, no d.j. (as issued). Some shelf-wear. Else clean copy. Very Good.
Verlag: American Chemical Society, 2004
ISBN 10: 084123857X ISBN 13: 9780841238572
Sprache: Englisch
Anbieter: Powell's Bookstores Chicago, ABAA, Chicago, IL, USA
Erstausgabe
EUR 15,57
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Used - Like New. 1st Edition. 2004. Hardcover. Fine.
Verlag: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Sprache: Englisch
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 36,34
Währung umrechnenAnzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Verlag: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 55,77
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbTaschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
Verlag: American Chemical Society, Washington D. C., 2004
ISBN 10: 084123857X ISBN 13: 9780841238572
Sprache: Englisch
Erstausgabe
EUR 175,41
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Good+. Zustand des Schutzumschlags: No Dust Jacket. ACS Symposium Series; Vol. 874; 9.21 X 0.81 X 6.14 inches; 335 pages; B&W illustrations. Graphs. Ex-Library copy with usual identifiers. Light rubbing on the back cover. Smudge on front cover's top edge. Good condition otherwise. No other noteworthy defects. No markings on text pages. ; - Your satisfaction is our priority. We offer free returns and respond promptly to all inquiries. Your item will be carefully cushioned in bubble wrap and securely boxed. All orders ship on the same or next business day. Buy with confidence. 1st Edition (Unstated); No Printing Stated.