ibrahim elfadel (40 Ergebnisse)

XIV, 255 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. IFIP Advances in Information and Communication Technology, Vol. 500. Sprache: Englisch.

382 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Analog Circuits and Signal Processing Sprache: Englisch.

Aufl. 2016. 235 mm x 155 mm, 0 g. XXIII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

Zustand: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.

Zustand: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.

Hardcover. Zustand: Brand New. 9.50x6.50x1.00 inches. In Stock.

Hardcover. Zustand: Very Good. 1. Auflage. unread, mimimum of shelfwear.

Paperback. Zustand: Brand New. 272 pages. 9.25x6.10x0.57 inches. In Stock.

Zustand: New.

Taschenbuch. Zustand: Neu. Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 364 pp. Englisch.

Buch. Zustand: Neu. Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 364 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Taschenbuch. Zustand: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 272 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They addressthe latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.

Gebunden. Zustand: New.

Hardcover. Zustand: Brand New. revised expanded edition. 332 pages. 9.26x6.11x9.21 inches. In Stock.

Buch. Zustand: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 272 pp. Englisch.

Buch. Zustand: Neu. Neuware -This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023.The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 332 pp. Englisch.

Paperback. Zustand: Brand New. 170 pages. 9.25x6.10x0.37 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They addressthe latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains revised and extendedversions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme ofVLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates,duringOctober 16-18, 2023.The15 full papers included in this volume were carefully revised and expanded from 77 paperssubmitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.

Buch. Zustand: Neu. Neuware -This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks. One such aspect is the ubiquitous use of tapered beams in the sensing and actuation elements of MEMS designs. As explained in this book, the tapered beam has distinct advantages over the standard rectangular beam but these advantages are often left unarticulated due to the blind trust in the finite-element models of MEMS devices. In this monograph, the authors take a fundamental, physics-based approach to the modeling of tapered beams in MEMS that is based on a rigorous perturbation analysis of the traditional Euler-Bernoulli beam. The authors demonstrate how perturbation methods combined with symbolic modeling and the tools of computer algebra enable the development of semi-analytical models for tapered-beam MEMS elements. They pay particular attention to the application of these novel models to piezoelectric MEMS energy harvesters with tapered-beam elements, including the development of lumped-parameter circuit models that can be readily used for fast electro-mechanical simulations. Another important aspect of MEMS designs that is extensively addressed in the book is the uncertainty quantification (UQ) of tapered-beam MEMS elements using both Monte Carlo and polynomial chaos expansion methods. These UQ methods are applied to the design of variation-aware piezoelectric energy harvesters. With consistent focus on MEMS devices with tapered beam elements, this up-to-date monographSpringer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 260 pp. Englisch.

Buch. Zustand: Neu. Neuware -This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry. These simplifications translate into lower power consumption, smaller form factors, and dynamic data rates that are tolerant to clock discrepancies between transmitter and receiver. Readers will be introduced to signal encoding that uses edge-coded signaling, based on the coding of binary data as counts of transmitted pulses. The authors fully explore the far-reaching implications of these novel signal-encoding techniques and illustrate how their usage can help minimize the need for complex circuitries for either clock and data recovery or duty-cycle correction. They also provide a detailed description of a complete ecosystem of hardware and firmware built around edge-code signaling. The ecosystem comprises an application-specific processor, automatic protocol configuration, power and data rate management, cryptographic primitives, and automatic failure recovery modes. The innovative IoT communication link and its associated ecosystem are fully in line with the standard IoT requirements on power, footprint, security, robustness, and reliability.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 172 pp. Englisch.

Hardcover. Zustand: Brand New. 250 pages. 9.25x6.10x9.21 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry. These simplifications translate into lower power consumption, smaller form factors, and dynamic data rates that are tolerant to clock discrepancies between transmitter and receiver. Readers will be introduced to signal encoding that uses edge-coded signaling, based on the coding of binary data as counts of transmitted pulses. The authors fully explore the far-reaching implications of these novel signal-encoding techniques and illustrate how their usage can help minimize the need for complex circuitries for either clock and data recovery or duty-cycle correction. They also provide a detailed description of a complete ecosystem of hardware and firmware built around edge-code signaling. The ecosystem comprises an application-specific processor, automatic protocol configuration, power and data rate management, cryptographic primitives, and automatic failure recovery modes. The innovative IoT communication link and its associated ecosystem are fully in line with the standard IoT requirements on power, footprint, security, robustness, and reliability.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry. These simplifications translate into lower power consumption, smaller form factors, and dynamic data rates that are tolerant to clock discrepancies between transmitter and receiver. Readers will be introduced to signal encoding that uses edge-coded signaling, based on the coding of binary data as counts of transmitted pulses. The authors fully explore the far-reaching implications of these novel signal-encoding techniques and illustrate how their usage can help minimize the need for complex circuitries for either clock and data recovery or duty-cycle correction. They also provide a detailed description of a complete ecosystem of hardware and firmware built around edge-code signaling. The ecosystem comprises an application-specific processor, automatic protocol configuration, power and data rate management, cryptographic primitives, and automatic failure recovery modes. The innovative IoT communication link and its associated ecosystem are fully in line with the standard IoT requirements on power, footprint, security, robustness, and reliability.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks. One such aspectis the ubiquitous use of tapered beams in the sensing and actuation elements of MEMS designs. As explained in this book, the tapered beam has distinct advantages overthe standard rectangular beam but these advantages are often left unarticulated due to the blind trust in the finite-element models of MEMS devices. In this monograph, the authors take a fundamental, physics-based approach to the modeling of tapered beams in MEMS that is based on a rigorous perturbation analysis of the traditional Euler-Bernoulli beam. The authors demonstrate how perturbation methods combined with symbolic modeling and the tools of computer algebra enable the development of semi-analytical models for tapered-beam MEMS elements. They pay particular attention to the application of these novel models to piezoelectric MEMS energy harvesters with tapered-beam elements, including the development of lumped-parameter circuit models that can be readily used for fast electro-mechanical simulations. Another important aspect of MEMS designs that is extensively addressed in the book is the uncertainty quantification (UQ) of tapered-beam MEMS elements using both Monte Carlo and polynomial chaos expansion methods. These UQ methods are applied to the design of variation-aware piezoelectric energy harvesters.With consistent focus on MEMS devices with tapered beam elements, this up-to-date monograph.

Zustand: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.