huang yongan (29 Ergebnisse)

XVII, 287 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

Softcover. Zustand: Très bon. Edition 2024. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Edition 2024. Ammareal gives back up to 15% of this item's net price to charity organizations.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 1284 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: New. pp. xxxiii + 1284.

Hardcover. Zustand: Brand New. 308 pages. 9.25x6.10x0.94 inches. In Stock.

Taschenbuch. Zustand: Neu. Intelligent Robotics and Applications | 10th International Conference, ICIRA 2017, Wuhan, China, August 16-18, 2017, Proceedings, Part III | Yongan Huang (u. a.) | Taschenbuch | xvii | Englisch | 2017 | Springer | EAN 9783319652979 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Intelligent Robotics and Applications | 10th International Conference, ICIRA 2017, Wuhan, China, August 16-18, 2017, Proceedings, Part II | Yongan Huang (u. a.) | Taschenbuch | xix | Englisch | 2017 | Springer | EAN 9783319652917 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Intelligent Robotics and Applications | 10th International Conference, ICIRA 2017, Wuhan, China, August 16-18, 2017, Proceedings, Part I | Yongan Huang (u. a.) | Taschenbuch | xxxiii | Englisch | 2017 | Springer | EAN 9783319652887 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Neuware -The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this third volume of the set are organized in topical sections on sensors and actuators;mobile robotics and path planning;virtual reality and artificial intelligence;aerial and space robotics;mechatronics and intelligent manufacturing.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 920 pp. Englisch.

Taschenbuch. Zustand: Neu. Neuware -The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this second volume of the set are organized in topical sections on industrial robot and robot manufacturing;mechanism and parallel robotics;machine and robot vision;robot grasping and control.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 932 pp. Englisch.

Taschenbuch. Zustand: Neu. Neuware -The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this first volume of the set are organized in topical sections onsoft, micro-nano, bio-inspired robotics;human-machine interaction;swarm robotics; underwater robotics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 924 pp. Englisch.

Buch. Zustand: Neu. Neuware -This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch.

Zustand: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | This book provides an overview of essential research on and developments in the electrohydrodynamic (EHD) direct-writing technique and its applications. Firstly, it presents mechano- and helix electrospinning methods to achieve direct writing of straight/serpentine micro/nano fibers in high resolution. Secondly, it examines functional inks and multi nozzle arrays for EHD printing, which are used to efficientlyform patterns and devices. Thirdly, the book discusses the various control methods adopted in the context of EHD to improve the controllability of the electrospun fibers. Lastly, it addresses the equipment used in EHD printing and its applications, while also outlining challenges for the field¿s future development. Combining academic and industrial viewpoints, the book provides in-depth information for experienced researchers, as well as a valuable guide for those just entering the field.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 1258 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this second volume of the set are organized in topical sections on industrial robot and robot manufacturing; mechanism and parallel robotics; machine and robot vision; robot grasping and control.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this third volume of the set are organized in topical sections on sensors and actuators; mobile robotics and path planning; virtual reality and artificial intelligence; aerial and space robotics; mechatronics and intelligent manufacturing.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this first volume of the set are organized in topical sections on soft, micro-nano, bio-inspired robotics; human-machine interaction; swarm robotics; underwater robotics.

Paperback. Zustand: Brand New. 920 pages. 9.25x6.10x1.97 inches. In Stock.

Paperback. Zustand: Brand New. 887 pages. 9.50x6.00x2.00 inches. In Stock.

Paperback. Zustand: Brand New. 932 pages. 9.25x6.25x2.00 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book systematically discusses the modeling and application oftransfer manipulationfor flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of theequipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field ofmicroelectronics.

Hardcover. Zustand: Brand New. 194 pages. 9.25x6.25x0.75 inches. In Stock.

Zustand: Hervorragend. Zustand: Hervorragend | Seiten: 432 | Sprache: Englisch | Produktart: Bücher | Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design likeliquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.

Taschenbuch. Zustand: Neu. Flexible Electronics | Theory and Method of Structural Design | Yongan Huang (u. a.) | Taschenbuch | xvii | Englisch | 2024 | Springer | EAN 9789811966255 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Zustand: Neu. Neuware -Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design likeliquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 432 pp. Englisch.

Buch. Zustand: Neu. Neuware -Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design likeliquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 432 pp. Englisch.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design likeliquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design likeliquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.

Hardcover. Zustand: Brand New. 429 pages. 9.25x6.10x1.02 inches. In Stock.