Anbieter: Phatpocket Limited, Waltham Abbey, HERTS, Vereinigtes Königreich
EUR 79,46
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
EUR 78,26
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In den WarenkorbZustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,600grams, ISBN:9780387220215.
EUR 100,81
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbZustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 123,63
Währung umrechnenAnzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
EUR 153,09
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In den WarenkorbZustand: Used. pp. 292 Illus.
EUR 54,93
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In den WarenkorbZustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
EUR 154,74
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In den WarenkorbZustand: Used. pp. 292.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 171,12
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In den WarenkorbZustand: New. In.
EUR 178,14
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In den WarenkorbGebunden. Zustand: New. Covers the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubesIntended as a good reference book for scientis.
Verlag: Springer New York, Springer New York, 2010
ISBN 10: 1441919562 ISBN 13: 9781441919564
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 165,03
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbTaschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thedemandfore cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth's atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci c example of the microelectronics area, the chip heat ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di cult to eliminate 'hot spots' completely. This is where high thermal conductivity materials nd most of their appli- tions, as 'heat spreaders'. The high thermal conductivity of these materials allows the heat to be carried away from the 'hot spots' very quickly in all directions thereby 'spreading' the heat. Heat spreading reduces the heat ux density, and thus makes it possible to cool systems using standard cooling solutions like nned heat sinks with forced air cooling.
EUR 235,70
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 1st edition. 271 pages. 9.50x6.50x0.75 inches. In Stock.
Verlag: Springer New York Nov 2005, 2005
ISBN 10: 0387220216 ISBN 13: 9780387220215
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 247,94
Währung umrechnenAnzahl: 2 verfügbar
In den WarenkorbBuch. Zustand: Neu. Neuware - The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes.The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries.Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.