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gebundene Ausgabe. Zustand: Gut. 225 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 620.
Sprache: Englisch
Verlag: Kluwer Academic Publishers, Boston, 2000
ISBN 10: 0792377966 ISBN 13: 9780792377962
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Verlag: Elsevier, London, 2009
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Sprache: Englisch
Verlag: Kluwer Academic Publishers, Norwell, Massachusetts, U.S.A., 2000
ISBN 10: 0792377966 ISBN 13: 9780792377962
Anbieter: PsychoBabel & Skoob Books, Didcot, Vereinigtes Königreich
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Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
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In den WarenkorbZustand: New. pp. 284 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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In den WarenkorbZustand: New. In English.
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In den WarenkorbZustand: New. pp. xv + 309 Illus.
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
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In den WarenkorbPaperback. Zustand: Brand New. 1st edition. 336 pages. 9.25x7.50x1.00 inches. In Stock.
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In den WarenkorbZustand: New. pp. 496.
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Sprache: Englisch
Verlag: Springer International Publishing, 2022
ISBN 10: 3030768872 ISBN 13: 9783030768874
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Hervorragend. Zustand: Hervorragend | Seiten: 268 | Sprache: Englisch | Produktart: Bücher | High efficiency, large scale, stationary computing systems ¿ supercomputers and data centers ¿ are becoming increasingly important due to the movement of data storage and processing onto remote cloud servers. This book is dedicated to a technology particularly appropriate for this application ¿ superconductive electronics, in particular, rapid single flux quantum circuits. The primary purpose of this book is to introduce and systematize recent developments in superconductive electronics into a cohesive whole to support the further development of large scale computing systems. A brief background into the physics of superconductivity and the operation of common superconductive devices is provided, followed by an introduction into different superconductive logic families, including the logic gates, interconnect, and bias current distribution. Synchronization, fabrication, and electronic design automation methodologies are presented, reviewing both widely established concepts and techniques as well as recent approaches. Issues related to memory, synchronization, bias networks, and testability are described, and models, circuits, algorithms, and design methodologies are discussed and placed in context. The aim of this book is to provide insight and engineering intuition into the design of large scale digital superconductive circuits and systems.
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Sprache: Englisch
Verlag: LAP LAMBERT Academic Publishing, 2012
ISBN 10: 3659259462 ISBN 13: 9783659259463
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In den WarenkorbPaperback. Zustand: Brand New. 2nd edition. 718 pages. 9.00x7.25x2.00 inches. In Stock.
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In den WarenkorbHardcover. Zustand: Brand New. 365 pages. 9.25x6.10x0.91 inches. In Stock.
Zustand: Gut. Zustand: Gut | Seiten: 332 | Sprache: Englisch | Produktart: Bücher | The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuitsis full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. On-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Zustand: Gut. Zustand: Gut | Seiten: 332 | Sprache: Englisch | Produktart: Bücher | The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuitsis full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. On-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
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