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In den WarenkorbZustand: Gut. 719 S. : Mit Abb., graph. Darst.; Sehr sauber und ohne Lesespuren / Very good condition, maybe unread book. Sprache: Englisch Gewicht in Gramm: 1193 24 cm, roter Org.-Pappb. / red hardcover.
EUR 95,13
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In den WarenkorbZustand: Sehr gut. Zustand: Sehr gut - Gepflegter, sauberer Zustand. | Seiten: 437 | Sprache: Englisch | Produktart: Bücher.
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In den WarenkorbZustand: Hervorragend. Zustand: Hervorragend | Seiten: 437 | Sprache: Englisch | Produktart: Bücher.
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In den Warenkorbpaperback. Zustand: Very Good.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 193,65
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In den WarenkorbZustand: New. In.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
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In den WarenkorbZustand: New. In.
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In den WarenkorbBuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
EUR 204,33
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In den WarenkorbGebunden. Zustand: New. Provides a comprehensive summary of the most recent advances in materials development for advanced packagingCovers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoe.
Verlag: Springer International Publishing, Springer Nature Switzerland, 2018
ISBN 10: 3319832093 ISBN 13: 9783319832098
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 235,39
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In den WarenkorbTaschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 281,74
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In den WarenkorbZustand: New. In.
Verlag: Springer International Publishing, Springer Nature Switzerland, 2016
ISBN 10: 3319450972 ISBN 13: 9783319450971
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 320,99
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbBuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.