Anbieter: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Deutschland
xiv, 520 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Hardcover. Zustand: Good. Unread, cover with shelfwear and small damages. Immediately dispatched from Germany.
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
gebundene Ausgabe. Zustand: Gut. 318 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 720.
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In den WarenkorbPaperback. Zustand: Brand New. 184 pages. 9.25x6.10x0.44 inches. In Stock.
Sprache: Englisch
Verlag: Springer International Publishing, 2021
ISBN 10: 3030387984 ISBN 13: 9783030387983
Anbieter: moluna, Greven, Deutschland
EUR 55,78
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In den WarenkorbKartoniert / Broschiert. Zustand: New.
Sprache: Englisch
Verlag: Springer International Publishing, 2020
ISBN 10: 303038795X ISBN 13: 9783030387952
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EUR 77,17
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In den WarenkorbGebunden. Zustand: New.
Sprache: Englisch
Verlag: Springer International Publishing, 2014
ISBN 10: 3319019961 ISBN 13: 9783319019963
Anbieter: moluna, Greven, Deutschland
EUR 92,27
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In den WarenkorbGebunden. Zustand: New.
Sprache: Englisch
Verlag: Springer International Publishing, 2016
ISBN 10: 3319345923 ISBN 13: 9783319345925
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In den WarenkorbZustand: New.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
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In den WarenkorbZustand: New. pp. 340 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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In den WarenkorbHardcover. Zustand: Brand New. 166 pages. 9.25x6.25x0.50 inches. In Stock.
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In den WarenkorbHardcover. Zustand: Brand New. 2015 edition. 300 pages. 9.75x6.75x0.75 inches. In Stock.
Sprache: Englisch
Verlag: Springer International Publishing, 2018
ISBN 10: 3319846620 ISBN 13: 9783319846620
Anbieter: moluna, Greven, Deutschland
EUR 115,65
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In den WarenkorbZustand: New.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing Aug 2016, 2016
ISBN 10: 3319345923 ISBN 13: 9783319345925
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. Neuware -This book provides a unified treatment of Flip-Flop design and selection in nanometer CMOS VLSI systems. The design aspects related to the energy-delay tradeoff in Flip-Flops are discussed, including their energy-optimal selection according to the targeted application, and the detailed circuit design in nanometer CMOS VLSI systems. Design strategies are derived in a coherent framework that includes explicitly nanometer effects, including leakage, layout parasitics and process/voltage/temperature variations, as main advances over the existing body of work in the field. The related design tradeoffs are explored in a wide range of applications and the related energy-performance targets. A wide range of existing and recently proposed Flip-Flop topologies are discussed. Theoretical foundations are provided to set the stage for the derivation of design guidelines, and emphasis is given on practical aspects and consequences of the presented results. Analytical models and derivations are introduced when needed to gain an insight into the inter-dependence of design parameters under practical constraints. This book serves as a valuable reference for practicing engineers working in the VLSI design area, and as text book for senior undergraduate, graduate and postgraduate students (already familiar with digital circuits and timing).Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 276 pp. Englisch.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing Okt 2014, 2014
ISBN 10: 3319019961 ISBN 13: 9783319019963
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Buch. Zustand: Neu. Neuware -This book provides a unified treatment of Flip-Flop design and selection in nanometer CMOS VLSI systems. The design aspects related to the energy-delay tradeoff in Flip-Flops are discussed, including their energy-optimal selection according to the targeted application, and the detailed circuit design in nanometer CMOS VLSI systems. Design strategies are derived in a coherent framework that includes explicitly nanometer effects, including leakage, layout parasitics and process/voltage/temperature variations, as main advances over the existing body of work in the field. The related design tradeoffs are explored in a wide range of applications and the related energy-performance targets. A wide range of existing and recently proposed Flip-Flop topologies are discussed. Theoretical foundations are provided to set the stage for the derivation of design guidelines, and emphasis is given on practical aspects and consequences of the presented results. Analytical models and derivations are introduced when needed to gain an insight into the inter-dependence of design parameters under practical constraints. This book serves as a valuable reference for practicing engineers working in the VLSI design area, and as text book for senior undergraduate, graduate and postgraduate students (already familiar with digital circuits and timing).Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 276 pp. Englisch.
Sprache: Englisch
Verlag: Springer International Publishing AG, 2014
ISBN 10: 3319019961 ISBN 13: 9783319019963
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New. Flip-Flop Design in Nanometer CMOS Num Pages: 275 pages, 118 black & white illustrations, 5 colour illustrations, 23 black & white tables, biograp. BIC Classification: TDPB; TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 160 x 245 x 15. Weight in Grams: 540. . 2014. Hardback. . . . . Books ship from the US and Ireland.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing, 2016
ISBN 10: 3319345923 ISBN 13: 9783319345925
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a unified treatment of Flip-Flop design and selection in nanometer CMOS VLSI systems. The design aspects related to the energy-delay tradeoff in Flip-Flops are discussed, including their energy-optimal selection according to the targeted application, and the detailed circuit design in nanometer CMOS VLSI systems. Design strategies are derived in a coherent framework that includes explicitly nanometer effects, including leakage, layout parasitics and process/voltage/temperature variations, as main advances over the existing body of work in the field. The related design tradeoffs are explored in a wide range of applications and the related energy-performance targets. A wide range of existing and recently proposed Flip-Flop topologies are discussed. Theoretical foundations are provided to set the stage for the derivation of design guidelines, and emphasis is given on practical aspects and consequences of the presented results. Analytical models and derivations are introduced when needed to gain an insight into the inter-dependence of design parameters under practical constraints. This book serves as a valuable reference for practicing engineers working in the VLSI design area, and as text book for senior undergraduate, graduate and postgraduate students (already familiar with digital circuits and timing).
Sprache: Englisch
Verlag: Springer International Publishing, 2014
ISBN 10: 3319019961 ISBN 13: 9783319019963
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a unified treatment of Flip-Flop design and selection in nanometer CMOS VLSI systems. The design aspects related to the energy-delay tradeoff in Flip-Flops are discussed, including their energy-optimal selection according to the targeted application, and the detailed circuit design in nanometer CMOS VLSI systems. Design strategies are derived in a coherent framework that includes explicitly nanometer effects, including leakage, layout parasitics and process/voltage/temperature variations, as main advances over the existing body of work in the field. The related design tradeoffs are explored in a wide range of applications and the related energy-performance targets. A wide range of existing and recently proposed Flip-Flop topologies are discussed. Theoretical foundations are provided to set the stage for the derivation of design guidelines, and emphasis is given on practical aspects and consequences of the presented results. Analytical models and derivations are introduced when needed to gain an insight into the inter-dependence of design parameters under practical constraints. This book serves as a valuable reference for practicing engineers working in the VLSI design area, and as text book for senior undergraduate, graduate and postgraduate students (already familiar with digital circuits and timing).
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 151,10
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In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 276 pages. 9.30x6.20x0.65 inches. In Stock.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 276 | Sprache: Englisch | Produktart: Bücher | This book provides a unified treatment of Flip-Flop design and selection in nanometer CMOS VLSI systems. The design aspects related to the energy-delay tradeoff in Flip-Flops are discussed, including their energy-optimal selection according to the targeted application, and the detailed circuit design in nanometer CMOS VLSI systems. Design strategies are derived in a coherent framework that includes explicitly nanometer effects, including leakage, layout parasitics and process/voltage/temperature variations, as main advances over the existing body of work in the field. The related design tradeoffs are explored in a wide range of applications and the related energy-performance targets. A wide range of existing and recently proposed Flip-Flop topologies are discussed. Theoretical foundations are provided to set the stage for the derivation of design guidelines, and emphasis is given on practical aspects and consequences of the presented results. Analytical models and derivations are introduced when needed to gain an insight into the inter-dependence of design parameters under practical constraints. This book serves as a valuable reference for practicing engineers working in the VLSI design area, and as text book for senior undergraduate, graduate and postgraduate students (already familiar with digital circuits and timing). .
EUR 136,16
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In den WarenkorbZustand: New.
EUR 136,16
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In den WarenkorbGebunden. Zustand: New.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing Jul 2018, 2018
ISBN 10: 3319846620 ISBN 13: 9783319846620
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. Neuware -This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia.After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT:ultra-low power digital architectures and circuitslow- and zero-leakage memories (including emerging technologies)circuits for hardware security and authenticationSystem on Chip design methodologieson-chip power management and energy harvestingultra-low power analog interfaces and analog-digital conversionshort-range radiosminiaturized battery technologiespackaging and assembly of IoT integrated systems (on silicon and non-silicon substrates).As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry.The unique balance between breadth and depth of this book:enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable futureprovides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected referencesmakes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits).Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 536 pp. Englisch.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3319846620 ISBN 13: 9783319846620
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia.After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT:ultra-low power digital architectures and circuitslow- and zero-leakage memories (including emerging technologies)circuits for hardware security and authenticationSystem on Chip design methodologieson-chip power management and energy harvestingultra-low power analog interfaces and analog-digital conversionshort-range radiosminiaturized battery technologiespackaging and assembly of IoT integrated systems (on silicon and non-silicon substrates).As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry.The unique balance between breadth and depth of this book:enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable futureprovides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected referencesmakes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits).
Sprache: Englisch
Verlag: Springer International Publishing, 2017
ISBN 10: 3319514806 ISBN 13: 9783319514802
Anbieter: moluna, Greven, Deutschland
EUR 158,41
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In den WarenkorbZustand: New.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 197,03
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In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 520 pages. 10.00x7.00x1.08 inches. In Stock.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 232,25
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In den WarenkorbPaperback. Zustand: Brand New. 318 pages. 9.45x6.30x0.76 inches. In Stock.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing Feb 2017, 2017
ISBN 10: 3319514806 ISBN 13: 9783319514802
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Buch. Zustand: Neu. Neuware -This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia.After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT:ultra-low power digital architectures and circuitslow- and zero-leakage memories (including emerging technologies)circuits for hardware security and authenticationSystem on Chip design methodologieson-chip power management and energy harvestingultra-low power analog interfaces and analog-digital conversionshort-range radiosminiaturized battery technologiespackaging and assembly of IoT integrated systems (on silicon and non-silicon substrates).As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry.The unique balance between breadth and depth of this book:enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable futureprovides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected referencesmakes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits).Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 536 pp. Englisch.
Sprache: Englisch
Verlag: Springer International Publishing, 2017
ISBN 10: 3319514806 ISBN 13: 9783319514802
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia.After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT:ultra-low power digital architectures and circuitslow- and zero-leakage memories (including emerging technologies)circuits for hardware security and authenticationSystem on Chip design methodologieson-chip power management and energy harvestingultra-low power analog interfaces and analog-digital conversionshort-range radiosminiaturized battery technologiespackaging and assembly of IoT integrated systems (on silicon and non-silicon substrates).As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry.The unique balance between breadth and depth of this book:enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable futureprovides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected referencesmakes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits).
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 279,54
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 520 pages. 10.25x7.25x1.25 inches. In Stock.