W s lau (28 Ergebnisse)

Zustand: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Zustand: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Paperback. Zustand: Good. General shelfwear to the cover and page edges.

Soft cover. Zustand: Very Good. ORIGINAL Publication; softcovers; in very good condition. Journal.

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,950grams, ISBN:9780023781407. …

Zustand: Very Good. : Este libro técnico es una guía exhaustiva sobre el diseño, materiales, procesos, fiabilidad y aplicaciones de los paquetes a escala de chip (CSP). Escrito por los expertos John H. Lau y Ricky S. W. Lee, la obra profundiza en las innovaciones tecnológicas necesarias para la miniaturización de componentes electrónicos.Es un recurso esencial para ingenieros y profesionales del sector de semiconductores, proporcionando un análisis detallado de los desafíos de fabricación y las soluciones de ingeniería en el empaquetado de circuitos integrados modernos. EAN: 0639785306085 Tipo: Libros Categoría: Tecnología|Ciencias Título: Chip scale package Autor: John H. Lau| Ricky S. W. Lee Editorial: McGraw-Hill Idioma: en Páginas: 500 Formato: tapa dura.…

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

hardcover. Zustand: very good(+). Zustand des Schutzumschlags: very good. xxvi + 603 pages. Tall 8vo, blue cloth, d.w. New York: Columbia University Press, 1978. A very good(+) copy in a very good dust wrapper.

Hardcover. Zustand: Used; Very Good. Dispatched, from the UK, within 48 hours of ordering. Though second-hand, the book is still in very good shape. Minimal signs of usage may include very minor creasing on the cover or on the spine.

Zustand: Used - Very Good. VG hardback. 1st ed. A tidy copy in tight binding, almost as-new. Used - Very Good. VG hardback.

Hardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Zustand: Good. Good condition. Good dust jacket. Bookplate inside. In protective mylar cover. (china, chinese fiction, translations into english) NOT AVAILABLE FOR SHIPMENT OUTSIDE OF THE UNITED STATES.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Good. : Este libro técnico proporciona una guía exhaustiva sobre las tecnologías de microvías y WLCSP, fundamentales para el diseño y la fabricación de sistemas de interconexión de alta densidad y bajo costo. A través de sus páginas, los autores John H. Lau y S.W. Ricky Lee exploran métodos para crear sistemas electrónicos más eficientes y fiables, incluyendo más de 500 ilustraciones detalladas y fotografías que facilitan la comprensión de procesos complejos como la perforación láser y mecánica en placas de circuito impreso.Dirigido a profesionales y académicos del área de la ingeniería electrónica y de telecomunicaciones, el texto aborda temas críticos como los materiales electrónicos, el control de costes en la construcción de circuitos integrados y las tecnologías de empaquetado microelectrónico. Es una referencia esencial para aquellos interesados en las últimas innovaciones en hardware y componentes de circuitos. EAN: 0639785322092 Tipo: Libros Categoría: Tecnología Título: Microvias: For Low Cost, High Density Interconnects Autor: John H. Lau| S.W. Ricky Lee Editorial: McGraw-Hill Professional Idioma: en Páginas: 565 Formato: tapa dura.…

Original publisher's sewn cream stapled wrappers, pictorial frontcover, 8vo: Vol. 1: Martin Luther: 26pp., 155 items described, with notes & references. 2: Jean Calvin & Théodore de Bèze: 26pp., items 156 - 304 described, with notes & references. 3: Engelse drukken tot 1640 (English printed books to 1640): 26pp., [ij], items 305 - 482 described, with notes & references, concordance STC. 4: Hugo de Groot: 28pp., items 482 - 624 described, with notes & references. 5: Niet-Nederlandse drukken 1501-1520 (Books printed outside the Netherlands and Belgium 1501-1520): 26pp., items 625 - 778 described, with notes & references, index. 6: Ulrich Zwingli & Heinrich Bullinger: 20pp., items 779 - 884 described, with notes & references. Very fine copies..…

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Encuadernación de tapa dura. Zustand: Bien. 1� Edición. New York Columbia University Press, 1978. Texto en inglés. XXV + 603 pp. 26 x 20. Tela editorial tapa dura con sobrecubierta de editorial ilustrada. Sin subrayados ni anotaciones. SOBRECUBIERTA FATIGADA, volumen en buen estado de conservación. ISBN: 0231040598. …

Zustand: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.

Zustand: New. In.

Zustand: Used. pp. 304 129 b/w & 8 col illus.

Paperback. Zustand: VG+. Paperback in Very Good+ condition. . Folio 13" - 23" tall. 326 pages. * Quick Shipping * All Books Mailed in Boxes * Free Tracking Provided *.

Zustand: Used. pp. 304.

Hardcover. Zustand: Brand New. 220 pages. 9.00x6.25x0.75 inches. In Stock.

Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.