Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75)
ISBN 10: 3642059155 ISBN 13: 9783642059155
Verlag: Springer, 2011
Neu
Softcover
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Beschreibung
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In. Bestandsnummer des Verkäufers ria9783642059155_new
Inhaltsangabe:
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Von der hinteren Coverseite: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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Bibliografische Details
Titel: Wafer Bonding: Applications and Technology (...
Verlag: Springer
Erscheinungsdatum: 2011
Einband: Softcover
Zustand: New