Uncertainty Quantification of Stochastic Defects in Materials (Emerging Materials and Technologies). Dieser Artikel ist nicht verfügbar.
Sprache: Englisch
Verlag: CRC Press, 2024
- Softcover
- Neu

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Artikelbeschreibung des Verkäufers
In English.
Bestandsnummer des Verkäufers ria9781032128757_new
- Titel
- Uncertainty Quantification of Stochastic Defects in Materials (Emerging Materials and Technologies)
- Autor
- Chu, Liu
- Verlag
- CRC Press
- Erscheinungsjahr
- 2024
- Zustand
- New
- Einband
- Softcover
- Sprache
- Englisch
- ISBN-10
- 1032128755
- ISBN-13
- 9781032128757
- Artikelgewicht
- 541 Gramm
- Serie
- Buch 17 von 50: Emerging Materials and Technologies
Uncertainty Quantification of Stochastic Defects in Materials investigates the uncertainty quantification methods for stochastic defects in material microstructures. It provides effective supplementary approaches for conventional experimental observation with the consideration of stochastic factors and uncertainty propagation. Pursuing a comprehensive numerical analytical system, this book establishes a fundamental framework for this topic, while emphasizing the importance of stochastic and uncertainty quantification analysis and the significant influence of microstructure defects on the material macro properties.
Key Features
- Applicable to MATLAB® and ANSYS software
This book is intended for advanced students interested in material defect quantification methods and material reliability assessment, researchers investigating artificial material microstructure optimization, and engineers working on defect influence analysis and nondestructive defect testing.
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Über die Autorin bzw. den Autor
Dr. Liu Chu received her B.E. degree in Materials Science and Engineering, and M.E. degree in Mechanics from Dalian Maritime University, China, and the Ph.D. in Mechanics from the Institut national des sciences appliquées de Rouen (INSA Rouen), France. Dr. Chu focuses on research in computational material mechanics and structural reliability. Her recent research interests include low-dimensional nanomaterial vacancy defects quantification, artificial material microstructure optimization, and mechanical structure reliability analysis. Since 2018, Dr. Chu has published 18 peer-reviewed science and technical papers in international journals and conferences. She is a member of IEEE and has served as a reviewer of several international journals.
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