Thin-Film Capacitors for Packaged Electronics
Pushkar, Jain, Rymaszewski, Eugene J.
ISBN 10: 140207705X ISBN 13: 9781402077050
Verlag: Springer, 2003
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Hardcover
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Beschreibung
Beschreibung:
2003. Hardcover. . . . . . Books ship from the US and Ireland. Bestandsnummer des Verkäufers V9781402077050
Inhaltsangabe:
Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.
Reseña del editor:
Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.
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Bibliografische Details
Titel: Thin-Film Capacitors for Packaged Electronics
Verlag: Springer
Erscheinungsdatum: 2003
Einband: Hardcover
Zustand: New
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Thin-Film Capacitors for Packaged Electronics
Verlag:
Springer US, Springer US Nov 2003, 2003
ISBN 10: 140207705X
ISBN 13: 9781402077050
Neu
Hardcover
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Buch. Zustand: Neu. Neuware -Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structuresElectrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz)Process modeling to determine stable operating pointsPrevention of metal (Cu) diffusion into the dielectricMeasurements and modeling of the dielectric micro-roughness.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 180 pp. Englisch. Artikel-Nr. 9781402077050
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Thin-Film Capacitors for Packaged Electronics
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness. Artikel-Nr. 9781402077050
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Thin-Film Capacitors for Packaged Electronics
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