Solder Joint Technology: Materials, Properties. Dieser Artikel ist nicht verfügbar.
Sprache: Englisch
Verlag: Springer, 2007
- Hardcover
- Neu
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USARomtrade Corp.
Verkäufer:in bei ZVAB seit 17. April 2013
Zustand: Neu
EUR 142,44
Artikelbeschreibung des Verkäufers
This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Bestandsnummer des Verkäufers ABBB-160818
- Titel
- Solder Joint Technology: Materials, Properties
- Autor
- Tu, King-Ning
- Verlag
- Springer
- Erscheinungsjahr
- 2007
- Zustand
- New
- Einband
- Hardcover
- Sprache
- Englisch
- ISBN-10
- 0387388907
- ISBN-13
- 9780387388908
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
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