Microscale Heat Transfer - Fundamentals and Applications (NATO Science Series II: Mathematics, Physics and Chemistry, 193)

Kaka�, S.

ISBN 10: 1402033605 ISBN 13: 9781402033605

Verlag: Springer, 2005

Sprache: Englisch

Zustand: Neu Softcover

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Bibliografische Details

Titel

Microscale Heat Transfer - Fundamentals and Applications (NATO Science Series II: Mathematics, Physics and Chemistry, 193)

Verlag

Springer

Erscheinungsjahr

2005

Sprache

Englisch

ISBN-10

1402033605

ISBN-13

9781402033605

Einband

Softcover

Zustand

New

Verk�uferkataloge

�ber diesen Titel

Inhaltsangabe

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer - Fundamental and Applications in Biological and Microelectromechanical Systems held in �esme - Izmir, Turkey, July 18-30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

Rese�a del editor

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in �esme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

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