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Digital Signal Integrity : Modeling and Simulation with Interconnects and Packages

Young, Brian

Verlag: Prentice-Hall, New Jersey, 2001
ISBN 10: 0130289043 / ISBN 13: 9780130289049
/ Gebraucht / Zustand: Very Good / Hardcover
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Bibliografische Details


Titel: Digital Signal Integrity : Modeling and ...

Verlag: Prentice-Hall, New Jersey

Erscheinungsdatum: 2001

Einband: hardcover

Zustand: Very Good

Zustand des Schutzumschlags: No Dust Jacket

Art des Buches: Used

Beschreibung:

Name from previous owner on FEP. No dust jacket. Binding is very well preserved, pages are clean and crisp, and printing is tight, clean and bright throughout. ISBN sticker on rear cover. MB. Buchnummer des Verkäufers 248554

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Bewertung (bereitgestellt von Goodreads):
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Inhaltsangabe:

For advanced courses in digital design.

This state-of-the-art book provides students with techniques for predicting and achieving target performance levels. Gives students all the theory, practice, general signal integrity issues, and leading-edge experimental techniques they need to accurately model and simulate those interconnections and predict real-world performance.

Klappentext:

  • State-of-the-art techniques for predicting and achieving target performance levels
  • Theory, practice, general signal integrity issues, and leading-edge experimental techniques

Model and simulate high-speed digital systems for maximum performance

Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes:

  • In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues
  • Multiconductor interconnects: packages, sockets, connectors and buses
  • Modal decomposition: understanding the outputs generated by commercial modeling software
  • Layer peeling with time-domain reflectometry: its power and limitations
  • Experimental techniques for characterizing interconnect parasitics

In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.

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