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Emerging Printing, Packaging and Communication Technologies (Lecture Notes in Electrical Engineering, 1668) - Hardcover

 
9789819223206: Emerging Printing, Packaging and Communication Technologies (Lecture Notes in Electrical Engineering, 1668)

Inhaltsangabe

This book includes original, peer-reviewed research papers from the 16th China Academic Conference on Printing and Packaging (CACPP 2025), held in Xi’an, China on November 13-15, 2025. The proceedings cover the recent findings in color science and technology, image processing technology, communication technology, mechanical and electronic engineering, materials and detection, printing and packaging technology, and so on. As such, the book is of interest to university researchers, R&D engineers and graduate students in the fields of printing and packaging engineering, color science, computer image, material science, computer science, communication technology, smart manufacturing technology, mechanical and electronic technology, and materials technology.

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Über die Autorin bzw. den Autor

Huihui SONG, Printing Technology Journals Press, NO.2 Cuiwei Road Beijing, China, 100036

Min XU, Printing Technology Journals Press, NO.2 Cuiwei Road Beijing, China, 100036

Li YANG, Printing Technology Journals Press, NO.2 Cuiwei Road Beijing, China, 100036

Linghao ZHANG, Printing Technology Journals Press, NO.2 Cuiwei Road Beijing, China, 100036

Yan CHEN, Printing Technology Journals Press, NO.2 Cuiwei Road Beijing, China, 100036

Von der hinteren Coverseite

This book includes original, peer-reviewed research papers from the 16th China Academic Conference on Printing and Packaging (CACPP 2025), held in Xi’an, China on November 13-15, 2025. The proceedings cover the recent findings in color science and technology, image processing technology, communication technology, mechanical and electronic engineering, materials and detection, printing and packaging technology, and so on. As such, the book is of interest to university researchers, R&D engineers and graduate students in the fields of printing and packaging engineering, color science, computer image, material science, computer science, communication technology, smart manufacturing technology, mechanical and electronic technology, and materials technology.

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