Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics, Band 24) - Softcover

Buch 10 von 72: Springer Series in Advanced Microelectronics

Dziuban, Jan A.

 
9789048171514: Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics, Band 24)
Softcover
ISBN 10: 9048171512 ISBN 13: 9789048171514
Verlag: Springer, 2010

Inhaltsangabe

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
Springer
Erscheinungsdatum
2010
Sprache
Englisch
ISBN 10 
9048171512
ISBN 13 
9789048171514
Einband
Taschenbuch
Anzahl der Seiten
352
Kontakt zum Hersteller
ProductSafety@springernature.com
ProductSafety@springernature.com

Poststr. 9
Darmstadt
64293
Deutschland

Weitere beliebte Ausgaben desselben Titels

9781402045783: Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics, 24, Band 24)

Vorgestellte Ausgabe

ISBN 10:  1402045786 ISBN 13:  9781402045783
Verlag: Springer, 2006
Hardcover