Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations.
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Dr.Ch.Srinivasa Rao, is presently working as a Professor of Mechanical Engineering in Kallam Haranadhareddy Institute of Technology, Chowdavaram, Guntur, Andhra Pradesh, INDIA. He has 22 years of teaching experience. He has published more than 50 research papers in reputed journals of national and international. He was a life time member of ISTE.
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Taschenbuch. Zustand: Neu. Neuware -Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations.Books on Demand GmbH, Überseering 33, 22297 Hamburg 52 pp. Englisch. Artikel-Nr. 9786203857481
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Taschenbuch. Zustand: Neu. Neuware - Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations. Artikel-Nr. 9786203857481
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Taschenbuch. Zustand: Neu. CFD Analysis of Heat Transfer problems | Simulation with ANSYS FLUENT | Chepuri Srinivasa Rao | Taschenbuch | Englisch | 2021 | LAP LAMBERT Academic Publishing | EAN 9786203857481 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. Artikel-Nr. 120201272
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Taschenbuch. Zustand: Neu. Neuware -Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations. 52 pp. Englisch. Artikel-Nr. 9786203857481
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