Verwandte Artikel zu Three-Dimensional Design Methodologies for Tree-based...

Three-Dimensional Design Methodologies for Tree-based FPGA Architecture: 350 (Lecture Notes in Electrical Engineering) - Softcover

 
9783319386874: Three-Dimensional Design Methodologies for Tree-based FPGA Architecture: 350 (Lecture Notes in Electrical Engineering)

Inhaltsangabe

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Von der hinteren Coverseite

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

  • VerlagSpringer
  • Erscheinungsdatum2016
  • ISBN 10 3319386875
  • ISBN 13 9783319386874
  • EinbandTapa blanda
  • SpracheEnglisch
  • Anzahl der Seiten248
  • Kontakt zum HerstellerNicht verfügbar

Gratis für den Versand innerhalb von/der Deutschland

Versandziele, Kosten & Dauer

Weitere beliebte Ausgaben desselben Titels

9783319191737: Three-Dimensional Design Methodologies for Tree-based FPGA Architecture: 350 (Lecture Notes in Electrical Engineering)

Vorgestellte Ausgabe

ISBN 10:  331919173X ISBN 13:  9783319191737
Verlag: Springer, 2015
Hardcover

Suchergebnisse für Three-Dimensional Design Methodologies for Tree-based...

Foto des Verkäufers

Vinod Pangracious
ISBN 10: 3319386875 ISBN 13: 9783319386874
Neu Taschenbuch

Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland

Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. Artikel-Nr. 9783319386874

Verkäufer kontaktieren

Neu kaufen

EUR 106,99
Währung umrechnen
Versand: Gratis
Innerhalb Deutschlands
Versandziele, Kosten & Dauer

Anzahl: 1 verfügbar

In den Warenkorb

Beispielbild für diese ISBN

Pangracious, Vinod; Marrakchi, Zied; Mehrez, Habib
Verlag: Springer, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Neu Softcover

Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich

Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

Zustand: New. In. Artikel-Nr. ria9783319386874_new

Verkäufer kontaktieren

Neu kaufen

EUR 119,33
Währung umrechnen
Versand: EUR 5,91
Von Vereinigtes Königreich nach Deutschland
Versandziele, Kosten & Dauer

Anzahl: Mehr als 20 verfügbar

In den Warenkorb

Beispielbild für diese ISBN

Pangracious, Vinod/ Marrakchi, Zied/ Mehrez, Habib
Verlag: Springer Verlag, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Neu Paperback

Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich

Verkäuferbewertung 5 von 5 Sternen 5 Sterne, Erfahren Sie mehr über Verkäufer-Bewertungen

Paperback. Zustand: Brand New. reprint edition. 247 pages. 9.25x6.10x0.53 inches. In Stock. Artikel-Nr. x-3319386875

Verkäufer kontaktieren

Neu kaufen

EUR 154,49
Währung umrechnen
Versand: EUR 11,87
Von Vereinigtes Königreich nach Deutschland
Versandziele, Kosten & Dauer

Anzahl: 2 verfügbar

In den Warenkorb