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Inhaltsangabe
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
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Über die Autorin bzw. den Autor
Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.
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This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
• Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs;
• Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations;
• Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
ISBN 10: 3319023772
ISBN 13: 9783319023779
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Buch. Zustand: Neu. Neuware -This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 264 pp. Englisch. Artikel-Nr. 9783319023779
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
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Springer International Publishing, 2013
ISBN 10: 3319023772
ISBN 13: 9783319023779
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable. Artikel-Nr. 9783319023779
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Hardcover. Zustand: Brand New. 2014 edition. 274 pages. 9.50x6.50x0.75 inches. In Stock. Artikel-Nr. x-3319023772
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