Interconnect Reliability in Advanced Memory Device Packaging (Springer Series in Reliability Engineering) - Softcover
Buch 86 von 90: Springer Series in Reliability Engineering
Inhaltsangabe
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.
In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.
This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.
In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.
This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
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Interconnect Reliability in Advanced Memory Device Packaging
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Taschenbuch. Zustand: Neu. Interconnect Reliability in Advanced Memory Device Packaging | Chong Leong Gan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | xviii | Englisch | 2024 | Springer | EAN 9783031267109 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Artikel-Nr. 129099572
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Interconnect Reliability in Advanced Memory Device Packaging
Verlag:
Springer International Publishing, 2024
ISBN 10: 3031267109
ISBN 13: 9783031267109
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. Artikel-Nr. 9783031267109
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