Production Planning and Control in Semiconductor Manufacturing: Big Data Analytics and Industry 4.0 Applications (SpringerBriefs in Applied Sciences and Technology) - Softcover

Buch 234 von 472: SpringerBriefs in Applied Sciences and Technology

Chen, Tin-Chih Toly

 
9783031140648: Production Planning and Control in Semiconductor Manufacturing: Big Data Analytics and Industry 4.0 Applications (SpringerBriefs in Applied Sciences and Technology)

Inhaltsangabe

This book systematically analyzes the applicability of big data analytics and Industry 4.0 from the perspective of semiconductor manufacturing management. It reports in real examples and presents case studies as supporting evidence. In recent years, technologies of big data analytics and Industry 4.0 have been frequently applied to the management of semiconductor manufacturing. However, related research results are mostly scattered in various journal issues or conference proceedings, and there is an urgent need for a systematic integration of these results. In addition, many related discussions have placed too much emphasis on the theoretical framework of information systems rather than on the needs of semiconductor manufacturing management. This book addresses these issues.

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Über die Autorin bzw. den Autor

Dr. Toly Chen has been the editor-in-chief of International Journal of Internet Manufacturing and Services. He also guest edited several special issues on 3D printing, ubiquitous manufacturing, and cloud manufacturing. Dr. Chen has published a few papers on semiconductor manufacturing management in journals such as Journal of Intelligent Manufacturing, Robotics and Computer-Integrated Manufacturing, International Journal of Advanced Manufacturing Technology, IEEE Transactions on Semiconductor Manufacturing.

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Weitere beliebte Ausgaben desselben Titels

9783031140662: Production Planning and Control in Semiconductor Manufacturing: Big Data Analytics and Industry 4.0 Applications

Vorgestellte Ausgabe

ISBN 10:  3031140664 ISBN 13:  9783031140662
Verlag: Springer, 2022
Softcover