Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System: An Edition of the Selected Papers from the 2017 ... Notes in Electrical Engineering, Band 501) - Softcover

Buch 303 von 548: Lecture Notes in Electrical Engineering
 
9783030080303: Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System: An Edition of the Selected Papers from the 2017 ... Notes in Electrical Engineering, Band 501)
Softcover
ISBN 10: 3030080307 ISBN 13: 9783030080303
Verlag: Springer, 2018

Inhaltsangabe

This book includes selected papers from the 13th IEEE International Conference on Multisensor Integration and Fusion for Intelligent Systems (MFI 2017) held in Daegu, Korea, November 16–22, 2017. It covers various topics, including sensor/actuator networks, distributed and cloud architectures, bio-inspired systems and evolutionary approaches, methods of cognitive sensor fusion, Bayesian approaches, fuzzy systems and neural networks, biomedical applications, autonomous land, sea and air vehicles, localization, tracking, SLAM, 3D perception, manipulation with multifinger hands, robotics, micro/nano systems, information fusion and sensors, and multimodal integration in HCI and HRI. The book is intended for robotics scientists, data and information fusion scientists, researchers and professionals at universities, research institutes and laboratories.

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Von der hinteren Coverseite

This book includes selected papers from the 13th IEEE International Conference on Multisensor Integration and Fusion for Intelligent Systems (MFI 2017) held in Daegu, Korea, November 16–22, 2017. It covers various topics, including sensor/actuator networks, distributed and cloud architectures, bio-inspired systems and evolutionary approaches, methods of cognitive sensor fusion, Bayesian approaches, fuzzy systems and neural networks, biomedical applications, autonomous land, sea and air vehicles, localization, tracking, SLAM, 3D perception, manipulation with multifinger hands, robotics, micro/nano systems, information fusion and sensors, and multimodal integration in HCI and HRI. The book is intended for robotics scientists, data and information fusion scientists, researchers and professionals at universities, research institutes and laboratories.

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Verlag
Springer
Erscheinungsdatum
2018
Sprache
Englisch
ISBN 10 
3030080307
ISBN 13 
9783030080303
Einband
Taschenbuch
Anzahl der Seiten
308
Herausgeber
Lee Sukhan, Ko Hanseok, Oh Songhwai
Kontakt zum Hersteller
ProductSafety@springernature.com
ProductSafety@springernature.com

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Darmstadt
64293
Deutschland

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9783319905082: Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System: An Edition of the Selected Papers from the 2017 ... in Electrical Engineering, 501, Band 501)

Vorgestellte Ausgabe

ISBN 10:  3319905082 ISBN 13:  9783319905082
Verlag: Springer, 2018
Hardcover