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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes) - Hardcover

 
9781852339418: Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

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The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products.

Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:

materials for silicon-based semiconductor devices (including high-k gate dielectric materials);

materials for nonvolatile memories;

materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and

materials for assembly and packaging

The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.

 

The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.

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9781849969673: Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

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ISBN 10:  1849969671 ISBN 13:  9781849969673
Verlag: Springer, 2010
Softcover

  • 9781848008441: Materials for Information Technology

    Springer, 2008
    Softcover

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Zschech, Ehrenfried|Whelan, Caroline|Mikolajick, Thomas
Verlag: Springer London (2005)
ISBN 10: 1852339411 ISBN 13: 9781852339418
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Buchbeschreibung Gebunden. Zustand: New. No other book covers all of the materials used in the information technology industry, covering characterisation, properties and synthesis of novel materials for this fast-changing industryDr Ehrenfried Zschech is manager of the Materials Anal. Artikel-Nr. 67170688

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