Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes) - Hardcover

Über die Autorin bzw. den Autor

Dr Ehrenfried Zschech is manager of the Materials Analysis Department at AMD Saxony LLC & Co. KG in Dresden, Germany. Advanced Microdevices (AMD) is a global manufacturer of microprocessors and other integrated circuit-based products. AMD’s manufacturing facility in Dresden is the company’s most advanced and the site also hosts the company’s European R&D centre.

Dr Zschech was the coordinator of the IT topic of EUROMAT 2003 in Lausanne. This book, although not a proceedings, has resulted from his work for the conference. It collects contributions on materials for information technology applications from the author’s of conference papers as well as chapters from other authors in order to create a state-of-the art edited volume on the subject from the world’s leading experts in academia and industry.

Dr Caroline Whelan is a researcher at the Interuniversity MicroElectronics Center (IMEC) Leuven, Belgium, a leading research institution in microelectronics funded by industry, government, ESA and the EU.

Dr Thomas Mikolajick is a researcher at Infineon Technologies AG, a German-based IC products manufacturers. Infineon’s R&D activities cover innovations in nano technologies, photonics, high frequency circuits, mixed signal circuits, electronic biosensors, systems technology, emerging applications.

Von der hinteren Coverseite

The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products.

Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:

materials for silicon-based semiconductor devices (including high-k gate dielectric materials);

materials for nonvolatile memories;

materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and

materials for assembly and packaging

The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.

The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.