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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan - Hardcover
Inhaltsangabe
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
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Über die Autorin bzw. den Autor
TETSUSHI SONOBE is a professorial fellow at the Foundation for Advanced Studies on International Development (FASID) and a professor at National Graduate Institute for Policy Studies (GRIPS), Japan. He received a PhD in Economics from Yale University and is the co-author of Cluster-Based Industrial Development: An East Asia Model (Palgrave Macmillan, 2006).KEIJIRO OTSUKA is a professorial fellow at FASID and a professor at GRIPS, Japan. He received a PhD in Economics from the University of Chicago and is the co-author of the above book. He is an Associate Editor of Economic Development and Cultural Change and the co-author or co-editor of sixteen books.
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This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
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Multilayer Ceramic Substrate - Technology for VLSI Package
Verlag:
Kluwer Academic Publishers Group, 1993
ISBN 10: 185166579X
ISBN 13: 9781851665792
Neu
Hardcover
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irland
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. Presents a translation of an important Japanese work on electronic ceramics and includes much experimental data. This title is of interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of Japanese research in this field. Num Pages: 242 pages, biography. BIC Classification: TDCQ; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 254 x 178 x 16. Weight in Grams: 1200. . 1993. Hardback. . . . . Artikel-Nr. V9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module : Ceramic research and development in Japan
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field. Artikel-Nr. 9781851665792
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EUR 358,67
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Beispielbild für diese ISBN
Multilayer Ceramic Substrate - Technology for VLSI Package
Verlag:
Kluwer Academic Publishers Group, 1993
ISBN 10: 185166579X
ISBN 13: 9781851665792
Neu
Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. Presents a translation of an important Japanese work on electronic ceramics and includes much experimental data. This title is of interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of Japanese research in this field. Num Pages: 242 pages, biography. BIC Classification: TDCQ; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 254 x 178 x 16. Weight in Grams: 1200. . 1993. Hardback. . . . . Books ship from the US and Ireland. Artikel-Nr. V9781851665792
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